Jared D. Stack
TE Connectivity
11 Papers
171 Citations
Jared D. Stack is an academic researcher from TE Connectivity. The author has contributed to research in topics: Backplane & Optical interconnect. The author has an hindex of 6, co-authored 11 publications.
Chat about Author
Papers
Polymer optical interconnect technology (POINT): optoelectronic packaging and interconnect for board and backplane applications
Y.S. Liu,R.J. Wojnarowski,W. B. Hennessy,Julian P. G. Bristow,Yue Liu,Andrzej Peczalski,John R. Rowlette,Alan Edward Plotts,Jared D. Stack,James T. Yardley,Louay Eldada,Richard M. Osgood,Robert Scarmozzino,Sing H. Lee,Volkan H. Ozguz +14 more
- 30 Jan 1996
TL;DR: The Polymer Optical Interconnect Technology (POINT) as mentioned in this paper represents a major collaborative effort among GE, Honeywell, AMP, AlliedSignal, Columbia University and the University of California at San Diego (UCSD), sponsored by ARPA, in developing affordable optoelectronic module packaging and interconnect technologies for board-and backplane-level optical interconnect applications for a wide range of military and commercial applications.
49
Polymer optical interconnect technology (POINT) optoelectronic packaging and interconnect for board and backplane applications
Y.S. Liu,R.J. Wojnarowski,W.A. Hennessy,Julian P. G. Bristow,Yue Liu,Andrzej Peczalski,John R. Rowlette,Alan Edward Plotts,Jared D. Stack,Michael Aaron Kadar-Kallen,J.T. Yardley,Louay Eldada,Richard M. Osgood,Robert Scarmozzino,Sing H. Lee,V. Ozgus,Susant K. Patra +16 more
- 28 May 1996
TL;DR: The Polymer Optical interconnect Technology (POINT) as mentioned in this paper is a collaborative program among GE, Honeywell, AMP, AlliedSignal, Columbia University and University of California at San Diego (UCSD) in developing affordable optoelectronic packaging and interconnect technologies for board-and backplane-level optical interconnect applications.
45
Plastic VCSEL array packaging and high density polymer waveguides for board and backplane optical interconnect
Y.S. Liu,R.J. Wojnarowski,W.A. Hennessy,P. A. Piacente,John R. Rowlette,Michael Aaron Kadar-Kallen,Jared D. Stack,Yue Liu,Andrzej Peczalski,Ajay Nahata,J.T. Yardley +10 more
- 25 May 1998
TL;DR: The Polymer Optical Interconnect Technology (POINT) program as mentioned in this paper is a collaborative effort among GE, Honeywell, AMP, AlliedSignal, Columbia University, and University of California at San Diego (UCSD), sponsored by DARPA/ETO.
30
High density optical interconnects for board and backplane applications using VCSELs and polymer waveguides
Y.S. Liu,R.J. Wojnarowski,W.A. Hennessy,John R. Rowlette,Jared D. Stack,Michael Aaron Kadar-Kallen,Eric T. Green,Yue Liu,Julian P. G. Bristow,Andrzej Peczalski,Louay Eldada,J.T. Yardley,Richard M. Osgood,Robert Scarmozzino,Sing H. Lee,Susant K. Patra +15 more
- 18 May 1997
TL;DR: The POINT (Polymer Optical Interconnect Technology) program as discussed by the authors is a collaborative effort among GE, Honeywell, AMP, AlliedSignal, Columbia University and University of California at San Diego (UCSD) to develop affordable optoelectronic packaging and interconnect technologies for board and backplane applications.
14
High density optical interconnects using VCSEL and polymer waveguides for board and backplane applications
Yue Liu,R.J. Wojnarowski,W.A. Hennessy,John R. Rowlette,Jared D. Stack,Michael Aaron Kadar-Kallen,Yue Liu,J.P. Bristow,A. Peczalski,Louay Eldada,J.T. Yardley,Richard M. Osgood,Robert Scarmozzino,Sing H. Lee,Susant K. Patra +14 more
- 10 Nov 1997
TL;DR: In this paper, the authors report the recent development of high density optical interconnect technology using VCSEL and polymer waveguides for board and backplane level applications, which offers a much higher data bandwidth and interconnect density with minimum cross-talk.
12