Jan Ellinger

TL;DR: In this paper, a verfahren zur Kapselung einer elektronischen Anordnung gegen Permeanten, bei dem eine Haftklebmasse auf Basis von Butylenblockcopolymeren, insbesondere Isobutylen blockcopolymers, was bereitgestellt wird and/or was die zu kapselnden Bereiche wird.

TL;DR: In this paper, a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangements is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the Electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape.

TL;DR: In this paper, the authors proposed a method to protect a flat adhesive compound from permeates originating from the surroundings as well as from the permeates trapped during lamination, winding, stacking or other processing steps.

TL;DR: In this article, an independent claim is included for electronic arrangement comprising organic electronic structure (3), and pressure-sensitive adhesive composition (5), where the electronic structure is at least partly encapsulated by the pressure sensitive adhesive composition.