An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant. A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.

Plastic integrated circuit package and method and leadframe for making the package

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Probe card assembly and kit, and methods of making same

A technique for interconnecting electronic components in which interconnection wires (7) are bonded to contacts (3) on a first component (1) without the use of a material other than the materials of the contacts and the wires; the wires are then severed to a desired length of between 2d and 20d, where d is the diameter of the wires, and bonded to contacts (23) on the second component (21) by means of a conductive material (27) such as solder. Preferably, solder is provided as pools located in recesses in a layer of insulating material. The invention also provides a bonding head for a wire bonder for bonding the wire to the contact on the first component and for weakening or severing the wire at the desired point.

Interconnection of electronic components

The present invention provides a high-speed electrical interconnection system designed to overcome the drawbacks of conventional interconnection systems. That is, the present invention provides an electrical connector capable of handling high-speed signals effectively.

High-speed electrical connector

An adapter to connect device leads to contacts arranged in a rectangle on a circuit surface. The adapter has a body and leads that extend outwardly, downwardly and then outwardly again in a pair of opposing curves to form feet which match the pattern on the circuit surface. The body has sites for connecting with the device and supports conductive elements connecting the leads to the sites. The adapter may connect gullwing-shaped device leads disposed in a rectangle (e.g., QFP) to contacts in a similar pattern. A substrate, such as a printed circuit board, may support the conductive elements. The conductive elements and adapter leads may be portions of a lead frame with portions of the body molded around them. A connector may provide connections between attachment sites and device leads. This connector may be a separate body, may include socket terminals, and may mate with another connector which has conductive elements for making connections between it and attachment sites on a second body, which may be contact pads for making solder connections to the leads of the device. Strain relief elements are shown. The body may include a stack of connected body portions. The device leads may be anchored in holes in the substrate, and may be bent portions of a lead frame sealed in a molded insulating body.

Integrated circuit adapter having gullwing-shaped leads

An adapter that is to be conneced to contacts on a mother circuit surface The adapter has a circuit bearing element, such as a printed circuit board, with connection sites that are connected to metalized holes opening onto its top side Leads are anchored (eg, by soldering) in the holes and bent down around the edge of the top side of the circuit bearing element to below it, and may be connected to the contacts on the mother circuit surface The leads may be provided to the circuit bearing element, using lead frame elements provided in a lead frame, by bending the lead frame elements, soldering them in holes in the circuit bearing element, bending the soldered leads down around the edge of the top surface of the circuit bearing element and below it, and removing a side frame portion from the bent lead frame Bending and cutting of the leads may be performed in a single operation with a single tool

Through hole mounting of integrated circuit adapter leads

A ball grid array socket assembly consists of a socket body having a plurality of vias extending through the socket body between upper and lower surfaces thereof, a plurality of electrically conductive contact assemblies respectively disposed in corresponding vias, and a releasable cover assembly. Each of the contact assemblies includes a lower terminal end projecting outwardly from the lower surface of the body for engaging a terminal pad on a circuit board, and further includes an upper multi-fingered contact arrangement for engaging a ball contact of a ball grid array package. Three separate embodiments of the contact assemblies are disclosed. In use, the ball grid array package is received in assembled relation with the socket body adjacent the upper surface thereof wherein the ball contacts of the ball grid array package are received into the vias in engaging electrical communication with the upper contact ends of the contact assemblies. The multi-fingered upper ends of the contact assemblies engage the BGA ball contact at multiple points to reduce creep associated failure of the contact, while a pivoting contact body portion provides relative movement between the BGA contact ball and the circuit board substrate to reduce thermal expansion stresses. The lower end of the contact assembly may comprise a removable, pivotable post which permits visual inspection of the terminal post solder joint on the terminal pad of the circuit board.

Ball grid array socket assembly

A method of providing such an intercoupling component includes positioning terminals within holes of an insulative support member and attaching a solder ball to each of the terminals. Attaching the solder ball to the terminals is accomplished using a fixture having a number of recesses located in a pattern corresponding to a pattern of the holes in the insulative support member; filling each of the recesses with a solder ball; positioning the insulative support member over the fixture so that an end of each of the terminals contacts a corresponding solder ball; soldering the solder ball to the end of the terminal while maintaining the generally spherical shape of the solder ball; and removing the insulative support member from the fixture. The solder balls are generally soldered by passing the insulative support member with terminals and fixture with solder balls through a reflow apparatus.

Solder ball terminal

An intercoupling component (10) (e.g. socket or adapter) is provided for increasing the dissipation of heat generated within an integrated circuit (IC) array (12) positioned within the intercoupling component (10), while maintaining a relatively low profile. The intercoupling component (10) includes a heat sink (30) positioned within the package support member (16) and having an upper surface (45) in contact with a lower surface of the integrated circuit package (12). The package support member (16) includes contact terminals (18) disposed within associated openings (20) of the package for electrically connecting the contacting areas of the integrated circuit package (12) to the corresponding connection regions of the substrate (14). The openings (20) extend from an upper surface to an opposite lower surface of the support member (16) and are located in a pattern corresponding to a pattern of the connection contacts. The heat sink (30) may be configured to be removable and replaceable.

Integrated circuit intercoupling component with heat sink

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