https://www.uvm.edu/giee/pubpdfs/Kobos_2006_Energy_Policy.pdf

Technological learning and renewable energy costs: implications for US renewable energy policy

This invention comprises manufacture of photovoltaic cells by deposition of thin film photovoltaic junctions on metal foil substrates. The photovoltaic junctions may be heat treated if appropriate following deposition in a continuous fashion without deterioration of the metal support structure. In a separate operation, an interconnection substrate structure is provided, optionally in a continuous fashion. Multiple photovoltaic cells are then laminated to the interconnection substrate structure and conductive joining methods are employed to complete the array. In this way the interconnection substrate structure can be uniquely formulated from polymer-based materials employing optimal processing unique to polymeric materials. Furthermore, the photovoltaic junction and its metal foil support can be produced in bulk without the need to use the expensive and intricate material removal operations currently taught in the art to achieve series interconnections.

Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays

Solar cells each include: an insulator connected to a back surface of a photoelectric conversion part; a first through-hole electrode penetrating the insulator, and electrically connected to a first collector electrode; and a second through-hole electrode penetrating the insulator, and electrically connected to a second collector electrode. In addition, a wiring member is disposed on the insulator.

Solar cell and solar cell module

A solar cell module includes: two solar cells, each including an photoelectric conversion body 10a, 10b having first and second main faces and generating photogenerated carriers, a first electrode provided on the first main face, and a second electrode provided on the first or second main face and having a polarity opposite to that of the first electrode; and a wiring member 2a for electrically connecting the first electrode of one of the two solar cells to the second electrode of the other solar cell. The first electrode has a plurality of finger electrodes for collecting the photogenerated carriers generated in the photoelectric conversion body 10a and a bus-bar electrode 11a for collecting the photogenerated carriers collected by the plurality of finger electrodes. The wiring member 2a is connected onto the bus-bar electrode 11a of the one solar cell through a connection layer 13 formed of a conductive resin containing conductive material. The connection layer 13 is also in contact with the first main face of the photoelectric conversion body 10a.

Solar cell module

A high efficiency configuration for a solar cell module comprises solar cells arranged in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency.

Shingled solar cell module

Methods and systems for interconnecting back contact solar cells. The solar cells preferably have reduced area busbars, or are entirely busbarless, and current is extracted from a variety of points on the interior of the cell surface. The interconnects preferably relieve stresses due to solder reflow and other thermal effects. The interconnects may be stamped and include external or internal structures which are bonded to the solder pads on the solar cell. These structures are designed to minimize thermal stresses between the interconnect and the solar cell. The interconnect may alternatively comprise porous metals such as wire mesh, wire cloth, or expanded metal, or corrugated or fingered strips. The interconnects are preferably electrically isolated from the solar cell by an insulator which is deposited on the cell, placed on the cell as a discrete layer, or laminated directly to desired areas of the interconnect.

Interconnect technologies for back contact solar cells and modules

Back contact solar cells including rear surface structures and methods for making same. The rear surface is doped to form an n+ emitter and then coated with a dielectric layer. Small regions are scribed in the rear surface and p-type contacts are then formed in the regions. Large conductive grid areas overlay the dielectric layer. The methods provide for increasing efficiency by minimizing p-type contact areas and maximizing n-type doped regions on the rear surface of a p-type substrate.

Process and fabrication methods for emitter wrap through back contact solar cells

Methods for fabrication of emitter wrap through (EWT) back-contact solar cells and cells made by such methods. Certain methods provide for higher concentration of dopant in conductive vias compared to the average dopant concentration on front or rear surfaces, and provided increased efficiency. Certain methods provide for selective doping to holes for forming conductive vias by use of printed dopant pastes. Other methods provide for use of spin-on glass substrates including dopant.

Back-contact solar cells and methods for fabrication

Back contact solar cells including rear surface structures and methods for making same. The rear surface has small contact areas through at least one dielectric layer, including but not limited to a passivation layer, a nitride layer, a diffusion barrier, and/or a metallization barrier. The dielectric layer is preferably screen printed. Large grid areas overlay the dielectric layer. The methods provide for increasing efficiency by minimizing p-type contact areas and maximizing n-type doped regions on the rear surface of a p-type substrate.

Contact fabrication of emitter wrap-through back contact silicon solar cells

Photovoltaic modules comprising back-contact solar cells manufactured using monolithic module assembly techniques comprising a flexible circuit comprising a back sheet and a patterned metallization. The module may comprise busses in electrical contact with the patterned metallization to extract the current. The module may alternatively comprise multilevel metallizations, lnterlayer dielectric comprising islands or dots relieves stresses due to thermal mismatch. The use of multiple cord plates enables flexible circuit layouts, thus optimizing the module. The modules preferably comprise a thermoplastic encapsulant and/or hybrid adhesive/solder materials. An ultrathin moisture barrier enables roll-to-roll processing.

Photovoltaic modules manufactured using monolithic module assembly techniques

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