What is index modulation (IM)? This is an interesting question that we have started to hear more and more frequently over the past few years. The aim of this paper is to answer this question in a comprehensive manner by covering not only the basic principles and emerging variants of IM, but also reviewing the most recent as well as promising advances in this field toward the application scenarios foreseen in next-generation wireless networks. More specifically, we investigate three forms of IM: spatial modulation, channel modulation and orthogonal frequency division multiplexing (OFDM) with IM, which consider the transmit antennas of a multiple-input multiple-output system, the radio frequency mirrors (parasitic elements) mounted at a transmit antenna and the subcarriers of an OFDM system for IM techniques, respectively. We present the up-to-date advances in these three promising frontiers and discuss possible future research directions for IM-based schemes toward low-complexity, spectrum- and energy-efficient next-generation wireless networks.

Index Modulation Techniques for Next-Generation Wireless Networks

BACKGROUND Three-dimensional (3D) printing, known more formally as additive manufacturing, has become the focus of media and public attention in recent years as the decades-old technology has at last approached the performance necessary for direct production of end-use devices. The most popular forms of standard 3D printing include vat photopolymerization, powder bed fusion, material extrusion, sheet lamination, directed energy deposition, material jetting, and binder jetting, each creating parts layer by layer and offering different options in terms of cost, feature detail, and materials. Whereas traditional manufacturing technologies, such as casting, forging, machining, and injection molding, are well suited for mass production of identical commodity items, 3D printing allows for the creation of complex geometric shapes that can be mass-customized, because no die or mold is required and design concepts are translated into products through direct digital manufacturing. Furthermore, the additively layered approach enables the merging of multiple components into a single piece, which removes the requirement for subsequent assembly operations. Recently, the patents for the original 3D printing processes have begun to expire, which is resulting in a burgeoning number of low-cost desktop systems that provide increased accessibility to society at large. Industry has recognized the manufacturing advantages of these technologies and is investing in production systems to make complex components for jet engines, customized bodies for cars, and even pharmaceuticals. Although standard 3D printing technologies have advanced so that it is now possible to print in a wide range of materials including metals, ceramics, and polymers, the resulting structures are generally limited to a single material, or, at best, a limited number of compatible materials. ADVANCES For the technology to become more widely adopted in mainstream manufacturing, 3D printing must provide end-use products by fabricating more than just simple structures with sufficient mechanical strength to retain shape. Recently, research has resulted in the capability to use new materials with commercial 3D printers, and customized printers have been enhanced with complementary traditional manufacturing processes, an approach known as multiprocess or hybrid 3D printing. Collectively, these advancements are leading to fabrications that are not only geometrically complex, but functionally complex as well. By introducing the robotic placement of components, micromachining for intricate detail, embedding of wires, and dispensing of functional inks, complex structures can be constructed with additional electronic, electromagnetic, optical, thermodynamic, chemical, and electromechanical content. OUTLOOK Multiprocess 3D printing is a nascent area of research in which basic 3D printing is augmented to fabricate structures with multifunctionality. Progress will lead to local manufacturing with customized 3D spatial control of material, geometry, and placement of subcomponents. This next generation of printers will allow for the fabrication of arbitrarily shaped end-use devices, leading to direct and distributed manufacturing of products ranging from human organs to satellites. The ramifications are substantial, given that 3D printing will enable the fabrication of customer-specific products locally and on demand, improving personalization and reducing shipping costs and delays. Examples could include replacement components for grain-milling equipment in a remote village in the developing world, biomedical devices created specifically for a patient in a hospital before surgery, and satellite components printed in orbit, thus avoiding the delays and costs associated with launch operations. The automotive, aerospace, defense, pharmaceutical, biomedical, and consumer industries, among others, will benefit from the new design and manufacturing freedom made possible by multiprocess 3D printing.

http://science.sciencemag.org/content/sci/353/6307/aaf2093.full.pdf

Multiprocess 3D printing for increasing component functionality.

Reconfigurable antennas, with the ability to radiate more than one pattern at different frequencies and polarizations, are necessary in modern telecommunication systems. The requirements for increased functionality (e.g., direction finding, beam steering, radar, control, and command) within a confined volume place a greater burden on today's transmitting and receiving systems. Reconfigurable antennas are a solution to this problem. This paper discusses the different reconfigurable components that can be used in an antenna to modify its structure and function. These reconfiguration techniques are either based on the integration of radio-frequency microelectromechanical systems (RF-MEMS), PIN diodes, varactors, photoconductive elements, or on the physical alteration of the antenna radiating structure, or on the use of smart materials such as ferrites and liquid crystals. Various activation mechanisms that can be used in each different reconfigurable implementation to achieve optimum performance are presented and discussed. Several examples of reconfigurable antennas for both terrestrial and space applications are highlighted, such as cognitive radio, multiple-input-multiple-output (MIMO) systems, and satellite communication.

Reconfigurable Antennas for Wireless and Space Applications

Linked: The New Science of Networks

While NASA explores the power of 3D printing in the development of the next generation space exploration vehicle, a CubeSat Trailblazer was launched in November 2013 that integrated 3D-printed structures with embedded electronics. Space provides a harsh environment necessary to demonstrate the durability of 3D-printed devices with radiation, extreme thermal cycling, and low pressure—all assaulting the structure at the atomic to macroscales. Consequently, devices that are operational in orbit can be relied upon in many terrestrial environments—including many defense and biomedical applications. The 3D-printed CubeSat module (a subsystem occupying approximately 10 % of the total volume offered by the 10 × 10 × 10-cm CubeSat enclosure) has a substrate that fits specifically into the available volume—exploiting 3D printing to provide volumetric efficiency. Based on the best fabrication technology at the time for 3D-printed electronics, stereolithography (SL), a vat photopolymerization technology, was used to fabricate the dielectric structure, while conductive inks were dispensed in channels to provide the electrical interconnect between components. In spite of the structure passing qualification—including temperature cycling, shock and vibration, and outgas testing—the photocurable materials used in SL do not provide the level of durability required for long-term functionality. Moreover, the conductive inks with low-temperature curing capabilities as required by the SL substrate material are widely known to provide suboptimal performance in terms of conductivity. To address these challenges in future 3D-printed electronics, a next generation machine is under development and being referred to as the multi3D system, which denotes the use of multiple technologies to produce 3D, multi-material, multifunctional devices. Based on an extrusion process necessary to replace photocurable polymers with thermoplastics, a material extrusion system based on fused deposition modeling (FDM) technology has been developed that integrates other technologies to compensate for FDM’s deficiencies in surface finish, minimum dimensional feature size, and porosity. Additionally, to minimize the use of conductive inks, a novel thermal embedding technology submerges copper wires into the thermoplastic dielectric structures during FDM process interruptions—providing high performance, robust interconnect, and ground planes—and serendipitously improving the mechanical properties of the structure. This paper compares and contrasts stereolithography used for 3D-printed electronics with the FDM-based system through experimental results and demonstrates an automated FDM-based process for producing features not achievable with FDM alone. In addition to the possibility of using direct write for electronic circuitry, the novel fabrication uses thermoplastics and copper wires that offer a substantial improvement in terms of performance and durability of 3D-printed electronics.

3D Printing multifunctionality: structures with electronics

Reconfigurability in an antenna system is a desired characteristic that has been the focus of much research in recent years. In this work, ohmic contact cantilever RF-MEMS switches are integrated with self-similar planar antennas to provide a reconfigurable antenna system that radiates similar patterns over a wide range of frequencies. The different issues encountered during the integration of the MEMS switches and the overall system design procedure are described herein. The final model radiates at three widely separated frequencies with very similar radiation patterns. The proposed concept can be extended to reconfigurable linear antenna arrays or to more complex antenna structures with large improvements in antenna performance.

Design, fabrication, and measurements of an RF-MEMS-based self-similar reconfigurable antenna

In recent years, the art of using neural networks (NNs) for wireless-communication engineering has been gaining momentum. Although it has been used for a variety of purposes and in different ways, the basic purpose of applying neural networks is to change from the lengthy analysis and design cycles required to develop high-performance systems to very short product-development times. This article overviews the current state of research in this area. Different applications of neural-network techniques for wireless communication front ends are briefly reviewed, stressing the purpose and the way neural networks have been implemented, followed by a description of future avenues of research in this field.

Applications of neural networks in wireless communications

When you buy a mouse for your computer, removing the packaging is probably the hardest part of integrating it into your home system. Once you plug in the USB cable, you click on the mouse, and it just works. For it to "just work," of course, a great many things have to happen in the background: Via the USB cable, the mouse's circuitry receives power, initializes, and is recognized by the computer as a valid device. Then the driver software takes over, identifying the device as a mouse and not, say, a printer or a keyboard. Finally, a rapid succession of electrical messages traverses the cable, and these messages are translated into commands that then move the cursor smoothly across your computer screen. The fact that you don't need to know any of this to operate a mouse is by design: The mouse's computer chips and embedded software conceal the device's complexity.

Plug-and-play satellites

Microelectromechanical sensors, ADXL50 and XMMAS40G accelerometers which are fabricated with surface micromachining techniques are characterized for their total dose radiation response. Different failure mechanisms were observed when the sensor element or the whole device was irradiated.

Total dose effects on Microelectromechanical Systems (MEMS): accelerometers

An architectural concept for field programmable gate array circuits is presented based on a universal fabric of cells called look-up tables arranged in a direct, repeatable spatial grid. It is predicated upon an analogy between Boolean functions and cellular automata wherein an m-variable look-up table defines a universal cellular automata of neighborhood size m. Its unique features include universal implementation of Boolean functions, low interconnect demand, no specialized routing resources, high regularity (periodic structures), fault tolerance, and ease in testability.

Molecular field programmable gate array

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