An apparatus for separating a laminated substrate assembly comprises at least a substantially planar assembly, a cutting member housing assembly positioned on a first side of the substantially planar assembly, a cutting member receiving assembly positioned on a second side of the substantially planar assembly, substantially opposite from the first side of the planar assembly suitable for receiving an amount of the elongated cutting member. At least one of the cutting member housing assembly or the cutting member receiving assembly is configured to provide an amount of tension to the elongated cutting member as the elongated cutting member is released by the cutting member housing assembly or received by the cutting member receiving assembly, and the elongated cutting member is configured to remove an amount of adhesive from an adhesive layer of the laminated substrate assembly.

System and method for disassembling laminated substrates

The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.

System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure

A method for laminating substrates may include disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate, disposing the first substrate, the pressure-sensitive adhesive layer, and the second substrate within a vacuum chamber, evacuating the vacuum chamber, and applying a pressure to at least one of the first substrate and the second substrate.

Substrate lamination system and method

The present invention is a process for performing a planarization treatment of pressure-sensitive adhesive (PSA). The process includes positioning a first substrate onto a support surface of a planarization tool. The process further includes placing at least one layer of PSA onto the first substrate. The process further includes positioning a second substrate onto the layer(s) of PSA. The process further includes applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner. Further, the applied pressure flattens the PSA between the first substrate and the second substrate for promoting suitability of the PSA for use in rigid-to-rigid lamination processes.

Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination

A device is disclosed for use with a method for reworking a bonded display (e.g., a LCD) having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the LCD. Use of the device provides for efficient and clean removal of the substrate from the display when necessary (e.g., when defect(s) are present) without damage to the display such that the display can subsequently be re-bonded as a component in a device being manufactured.

Semi-automated reworkability equipment for de-bonding a display

An apparatus for cutting any one of blocks and panels of cellular plastics into various shapes. The cellular plastic is held on a stationary platform around which a movable frame is affixed to two slides. The movable frame moves on two horizontal rails to effect cutting in the x-direction. Cutting is done with a hot wire affixed to two slides which move together vertically on vertical rails along the moveable frame to effect cutting in the y-direction. Stepping motors are driven by a computer to provide for displacement of the hot wire. Each motor includes a pinion which is mounted on a shaft directly engaging gear-racks parallel to the rails, to effect cutting of various shapes defined by the equation y=f(x).

Method and apparatus for cutting blocks and panels of cellular plastic

Method and device for cutting blocks and plates of expanded synthetic materials (5) placed and held on a fixed platform (4) around which moves a movable frame (6) fastened on two slides (7) and (8) moving on two horizontal rails, providing cutting along the axis X. Cutting-out is performed by a hot wire fastened on two slides (11) and (12) moving vertically together on vertical rails along the movable frame (6), providing cutting along the axis Y. The movements of the two slides (11, 12) are ensured by stepping motors (9), (10), (13) and (14), controlled by a computer (17), these motors having a pinion mounted on the shaft directly meshing with racks (2) and (3) parallel to the rails and providing cutting of all shapes of type Y = F(X).

Method and device for cutting blocks and plates of expanded synthetic materials

Procede et appareil pour decouper des blocs et des plaques de materiaux synthetiques cellulaires (5) poses et maintenus sur un plateau fixe (4) autour duquel se deplace un cadre mobile (6) fixe sur deux glissieres (7) et (8) se deplacant sur deux rails horizontaux, assurant la coupe suivant l'axe X. La decoupe est realisee par un fil chaud fixe sur deux glissieres (11) et (12) se deplacant verticalement ensembles sur des rails verticaux le long du cadre mobile (6), assurant la coupe suivant l'axe Y. Selon l'invention, les deplacements sont assures par des moteurs Pas a pas (9), (10), (13) et (14), pilotes par un ordinateur (17), ces moteurs ayant un pignon monte sur l'axe attaquant directement des cremailleres (2) et (3) paralleles aux rails et assurant la coupe de toutes formes de type Y = F (X).

Procede et appareil pour couper des blocs et des plaques de materiaux synthetiques cellulaires.

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Method and apparatus for cutting blocks and panels of cellular plastic

Method and device for cutting blocks and plates of expanded synthetic materials

Procede et appareil pour couper des blocs et des plaques de materiaux synthetiques cellulaires.