Overmolding process is one of the growing advanced technologies for fabricating lightweight composite structures used in the aerospace and automotive industries. This technology enables integrating multiple types of reinforcements from macro- to nano-scale in thermoplastic and thermoset matrices and assembling of dissimilar polymeric materials. Besides, this process is well suited to a digitalization of advanced composite manufacturing for complex geometries with outstanding performance and high adaptation to multifunctionality. The present review aims to cover the recent developments in the design and fabrication of thermoset- and thermoplastic-based composite systems via overmolding process under (i) multi-material injection molding and (ii) insert molding technologies with the employment of nano/micron-scale reinforcements. Multi-material injection molding (or over injection) is investigated by considering two or more thermoplastic polymeric systems in a single mold to obtain high structural performance and bonding quality. On the other hand, the insert molding process is evaluated through matrix and reinforcement types to understand the strength and structural integrity during composite manufacturing. The main bottleneck of adhesion strength in the overmolding process is elaborated with the discussion of distributive approaches and offers a new perspective in producing multi-functional composites in a single-step process with design tools.

Recent developments on the overmolding process for the fabrication of thermoset and thermoplastic composites by the integration of nano/micron-scale reinforcements

Combination of 3D printing and injection molding: Overmolding and overprinting

The failure of interfaces between a series of styrene-butadiene random linear monodisperse polymer melts was investigated with a contact mechanics method A thin (1μm) and a thick (150μm) film of the same polymer were deposited on a metallic cylindrical probe and on a glass slide, respectively The two films were put in contact for up to 1000s in a very confined geometry and the mechanical strength of interfaces formed in these conditions was then characterized by separating the probe from the glass slide We observed different deformation micromechanisms of the layers depending on the time of contact, the debonding velocity, and the polymer used We found that these different behaviors could be represented in a general deformation map as a function of two reduced parameters: the ratio between the contact time and the reptation time and the Deborah number For values of De Decrit, two regimes were obse

Adhesion at interfaces between highly entangled polymer melts

Crystallization kinetics of polypropylene/ethylene–octene copolymer blends

An encapsulating material for solar cell of the invention contains an ethylene/α-olefin copolymer, an organic peroxide, at least one crosslinking aid selected from a group consisting of divinyl aromatic compounds, cyanurates, diallyl compounds, triallyl compounds, oximes and maleimides, and a (meth)acrylate-based monomer. The content of the (meth)acrylate-based monomer in the encapsulating material for solar cell is in a range of 0.1 parts by weight to 5.0 parts by weight with respect to 100 parts by weight of the ethylene/α-olefin copolymer, and the content of the crosslinking aid in the encapsulating material for solar cell is in a range of 0.1 parts by weight to 3 parts by weight with respect to 100 parts by weight of the ethylene/α-olefin copolymer.

Encapsulating material for solar cell and solar cell module

A systematic approach was used to study and compare the bonding of an ethylene-octene random copolymer and a low-density polymer, injection molded over polypropylene homopolymer. Wide ranges of overmolding and cooling interface temperatures and packing pressures were explored. Standard peeling tests were conducted at room temperature on overmolded samples, to measure the bonding strength. Large differences were found for bonding strength for both ethylene-based polymers, which are explained on a molecular basis. The analysis of the experimental results gives strong indications about the bonding mechanism and the temperatures and time scaleinvolved in the process. Simple, reliable rules to design the overmolding process parameters for these polymers pairs are developed. Polym. Eng. Sci. 44:2110–2116, 2004. © 2004 Society of Plastics Engineers.

Sequential injection overmolding of an elastomeric ethylene-octene copolymer on a polypropylene homopolymer core

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Sequential injection overmolding of an elastomeric ethylene-octene copolymer on a polypropylene homopolymer core