J. Borglind
4 Papers
70 Citations
J. Borglind is an academic researcher. The author has contributed to research in topics: Wafer dicing & Detector. The author has an hindex of 4, co-authored 4 publications.
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Papers
X-ray imaging using a 320/spl times/240 hybrid GaAs pixel detector
R. Irsigler,J. Andersson,J. Alverbro,J. Borglind,Christer Fröjdh,P. Helander,S. Manolopoulos,H. Martijn,Val O'Shea,Kevin M. Smith +9 more
- 01 Jan 1998
TL;DR: In this paper, the authors presented room temperature measurements on 200 /spl mu/m thick GaAs pixel detectors, which were hybridized to silicon readout circuits for X-ray applications.
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Evaluation of 320×240 pixel LEC GaAs Schottky barrier X-ray imaging arrays, hybridized to CMOS readout circuit based on charge integration
R. Irsigler,J. Andersson,J. Alverbro,J. Borglind,Ch. Fröjdh,P. Helander,S. Manolopoulos,Val O'Shea,Kevin M. Smith +8 more
TL;DR: In this paper, a detector chip was based on semi-insulating LEC GaAs material and had a pitch of 38 μ m. The detector wafers were thinned down prior to the fabrication of the ohmic back contact after dicing, the chips were indium bump, flip-chip bonded to CMOS readout circuits based on charge integration, and finally evaluated.
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A 320 × 240 pixels quantum well infrared photodetector array for thermal imaging
P. Helander,J. Andersson,J. Alverbro,J. Borglind,Z. Fakoor-Biniaz,Y Eriksson,U Halldin,H. Martijn,P J Tolf,M. Östlund +9 more
TL;DR: In this paper, the infrared pixel detectors with a quantum well structure based on n-doped AlGaAs/GaAs were fabricated and evaluated using indium bumps, and the two parts were hybridized by a flip-chip technique using INDIUM bumps, which removed the problem with thermal mismatch, enhanced the absorption and eliminated optical crosstalk between pixels.
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