Hyo Jong Lee
Pukyong National University
5 Papers
142 Citations
Hyo Jong Lee is an academic researcher from Pukyong National University. The author has contributed to research in topics: Light-emitting diode & Nitride. The author has an hindex of 3, co-authored 3 publications.
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Papers
Patent
Light emitting diode package and method for manufacturing the same
Ahn Hyung Soo,Min Yang,Kee Sam Shin,Sam Nyung Yi,Hyo Jong Lee,Moon Yeoung Yu +5 more
- 26 Apr 2013
TL;DR: In this paper, a nitride light emitting diode (LED) was proposed, which can improve light-emitting efficiency by increasing light emitting surface area and reducing operating voltage by simultaneously emitting light from six cells at once.
101
Patent
Light emitting diode package and method for manufacturing same
Hyung Soo Ahn,안형수,Min Yang,양민,Kee Sam Shin,신기삼,Sam Nyung Yi,이삼녕,Hyo Jong Lee,이효종,Yeoung Moon Yu,유영문 +11 more
- 26 Apr 2013
TL;DR: In this paper, a nitride light emitting diode (LED) was proposed, which can improve light-emitting efficiency by increasing light emitting surface area, reduce operating voltage by simultaneously emitting light from six cells at once.
38
Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias.
TL;DR: The microstructure and crystallographic texture of copper electrodeposits in millimeter scale through silicon vias are characterized using electron backscatter diffraction as mentioned in this paper , and columnar grains of Cu capture the linear motion of the local growth front during filling with a strong <110> orientation.
4
Patent
Led package and manufacturing method thereof
Hyung Soo Ahn,Min Yang,Kee Sam Shin,Sam Nyung Yi,Hyo Jong Lee,Yeoung Moon Yu +5 more
- 08 Oct 2013
TL;DR: In this article, a light emitting diode package and a manufacturing method are provided to reduce an operating voltage by simultaneously emitting light from six cells, where a plurality of LED cells are formed on a substrate two or more groups are composed of the LED cells.
3
Multilayer Laminated Copper Electrodeposits and Their Mechanical Properties
TL;DR: In this paper , two electroplating methods are proposed based on the concentration of the additive in the plating solution and by modulating the current density to develop multilayer laminate structures with alternating layers exhibiting different recrystallization behaviors to enhance the mechanical properties of Cu foils.
3