Segregation-assisted phase transformation and anti-phase boundary formation during creep of a γ′-strengthened Co-based superalloy at high temperatures

Molecular dynamics simulation of rhenium effects on creep behavior of Ni-based single crystal superalloys

A novel low-density nickel-based single-crystal superalloy was prepared and the effect of solution treatment on the creep deformation mechanism was systematically investigated. The results reveal that the creep life increases with the increase of solution treatment time, which can be ascribed to microstructural homogenization. However, when the solution treatment time exceeds a threshold limit, the relative proportion of undesirable defects significantly increases, which accelerates the failure and compromises the creep life. The homogenization of the composition leads to the precipitation of a more homogenized γ′ phase and, in turn, results in a more uniform and dense dislocation network, thus hindering the dislocation movement and improving the creep life. The undesirable defects may lead to the stress concentration and weaken the effect of the dislocation network, thus accelerating the creep process and the dislocation are more likely to shear into the γ′ phase. In general, the current study provides guidance for selecting a more reasonable solution treatment time to improve the creep strength.

Effect of solution heat treatment on creep properties of a nickel-based single crystal superalloy

Evolution of crystallographic orientation and microstructure in the triangular adapter of grain continuator of a 3rd-generation single crystal superalloy casting during directional solidification

Effect of solid solution heat treatment duration on microstructure evolution and the high temperature and low stress creep properties of a low-cost fourth-generation single crystal superalloy

There are many metal and epoxy resin interfacial structures in power equipments, which can generate interfacial stress concentrations and may induce accidents due to epoxy curing. In this paper, through simplifying interface structure into a coaxial cylindrical model, the formation mechanism of interfacial stress concentration of this interface structure was studied during epoxy resin curing process. The strain and temperature at the interface were measured by the strain and temperature measurement system. Then a model for calculating the interface stress distribution was established, including the heat conduction module, curing dynamics module and curing deformation module. The validity of the model was verified by comparing the calculated results with the measured results. In addition, the air gap defects at the interface, appearing after the curing process, were simulated. The results show that, after the curing process, the first principal stress at the centre of the interface gradually increases from the centre to the edge, reaching 41.06 and 40.20 MPa at the upper and lower edges respectively. The existence of air gap leads to partial discharge at low voltage. The calculation model can be extended to the stress prediction between the metal and epoxy resin in other power equipments. 

Numerical simulation of the interfacial stress between epoxy resin and metal conductor of power equipment during epoxy curing

Liquid rubber toughened epoxy resins are widely used in electrical equipment and electronic packaging. Previous studies have only investigated the relaxation process of epoxy resins through dielectric spectroscopy. The trap characteristics of the relaxation process by thermally stimulated depolarization current (TSDC) analysis are less studied. In this work, TSDC and broadband dielectric spectroscopy techniques were used to complementarily characterize the dielectric relaxation process of hydroxyl-terminated liquid nitrile-butadiene rubber (HTBN) toughened epoxy resin polymers. The experimental results show that HTBN introduces two new relaxation processes in the epoxy matrix, which are attributed to the α polarization of the rubber molecule and the interfacial polarization based on the correlation between the TSDC and the dielectric spectroscopy data, respectively. The trap parameters of each TSDC current peak were obtained using the multi-peak fitting method. The addition of rubber increases the trap density in epoxy composites significantly, especially for traps with energy levels in the range of 0.5–0.9 eV. The trap energy level of the DC conductivity process increases with increasing rubber concentration. The above results provide analytical ideas for rubber-toughened epoxy resins’ polarization and trap characteristics and theoretical guidance for formulation improvement.

/pdf/study-of-relaxations-in-epoxy-rubber-composites-by-thermally-3k9v6hco.pdf

Study of Relaxations in Epoxy/Rubber Composites by Thermally Stimulated Depolarization Current and Dielectric Spectroscopy

The micro-mechanism of rhenium promoting the formation of stacking faults in the Ni-based model single crystal superalloys

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Papers

Numerical simulation of the interfacial stress between epoxy resin and metal conductor of power equipment during epoxy curing

Study of Relaxations in Epoxy/Rubber Composites by Thermally Stimulated Depolarization Current and Dielectric Spectroscopy

The micro-mechanism of rhenium promoting the formation of stacking faults in the Ni-based model single crystal superalloys