Preparing an effective and long-term reliable contact between a thermoelectric (TE) element and its electrode is a key issue in integrating TE elements into practical devices In this work, Cu electrodes were bonded to Mg2Si by using the spark plasma sintering (SPS) technique To investigate their thermal stability, Mg2Si/Cu joints were annealed in vacuum at different temperatures (500°C, 550°C, and 580°C) for different durations (24 h, 48 h, and 72 h) Scanning electron microscopy (SEM) images illustrated that an intermediate layer with thickness of approximately 10 μm developed between Mg2Si and Cu during the sintering process Electron probe microanalysis (EPMA) indicated that Mg, Si, and Cu diffused into each other and formed a τ3-phase at the interlayer After annealing at 500°C for 72 h, the Mg2Si/Cu joints still possessed good adhesion and showed no cracks; the thickness and the elemental fractions within the interlayer did not show an obvious difference due to the thermal treatment The electrical contact resistance increased slightly while the shear strength of the Mg2Si/Cu joints decreased with increasing aging time However, when increasing the annealing temperature to 550°C, cracks developed along the boundary of the intermediate layer close to the Cu layer Severer cracks were observed with higher aging temperature of 580°C Therefore, it is evident that the Mg2Si/Cu joints exhibited good thermal reliability with stable microstructure, relatively unchanged electrical contact, and sufficient bonding strength at operating temperatures below 500°C

Duration of Thermal Stability and Mechanical Properties of Mg 2 Si/Cu Thermoelectric Joints

Enhanced Interface Stability of Multilayer Bi2Te3/Ti/Cu Films after Heat Treatment via the Insertion of a Ti Layer

This paper reports the synthesis and application of nanosilver antibacterial materials. The preparation methods of nanosilver complexes are described. The effect of silver nitrate concentration and nanosilver dispersion on antibacterial properties was analysed. In this experiment, TEMPO oxidant was used to oxidize hydroxyl on the C6 position of wood nanocellulose into a carboxyl group. Meanwhile, carboxyl compound was used to react with AgNO3, the silver composite material was prepared with PVA as the substrate. We use interface grafting. The surface of cellulose is bonded with reactive functional groups to form a transition layer. To improve the interface bonding between matrix and reinforcing fiber. The Ag-NC-PVA nanocomposite film was characterized by UV–Vis, SEM, TEM, mechanical properties and antibacterial properties analysis. SEM and TEM images showed that the size of most silver nanoparticles ranged from 5 to 20 nm; the mean particle size was 10 nm. The mechanical properties of Ag-NC-PVA films were greater than that of PVA film. When the amount of Ag-NC was 4%, its tensile strength was 71.3 MPa; it’s almost 15% higher than PVA. After antibacterial analysis, Ag-NC endowed PVA with excellent antibacterial properties. The prepared Ag-NC-PVA greatly promotes the practical application development of the silver-based composite bacteriostatic material.

Preparation and Properties of Silver-Based Cellulose/Polyvinyl Alcohol Antibacterial Materials

Joining of thermoelectric material with metallic electrode using Spark Plasma Sintering (SPS) technique

In this work, the creep samples of sintered silver were prepared by the chemical reduction method. According to the creep testing results, the Anand constitutive model was established to demonstrate the creep characteristics of sintered silver within a certain temperature range. According to the finite element electro-thermal–mechanical coupling analysis, the cyclic creep characteristics of sintered silver solder in the SiC-IGBT module under power cycling were simulated. The results shows that the sintering pressure and temperature can greatly promote the integrity of sintered silver by enhancing inert-particle bonding strength, and the established Anand model can effectively describe the creep behavior of sintered silver. The predicted results from electro-thermal–mechanical simulation were in good agreement with the power cycling testing results under the same condition. The finite element-based creep fatigue model is effective in predicting the creep fatigue life of sintered silver solders. 

Thermal creep and fatigue failure of the sintered silver solder in a SiC-IGBT module under power cycling

Interfacial evolution behavior of AgSbTe2.01/nanosilver/Cu thermoelectric joints

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Interfacial evolution behavior of AgSbTe2.01/nanosilver/Cu thermoelectric joints