Investigation of thermal phase evolution in Cr2(C,N) inhibitor for optimizing high-performance cemented carbide sintering process

Combining the structural advantages of SiC with super thermal conductivity of diamond to construct an efficient heat dissipation substrate for GaN-based transistors is a promising strategy to solve the self-heating problem. Herein, a scheme for direct growth of polycrystalline diamond on 4H–SiC substrate, followed by thinning of the 4H–SiC substrate to an optimum thickness, is designed and implemented. Diamond-SiC composite substrates consisting of 200 μm 4H–SiC and 200 μm diamond are fabricated. The simulation of GaN devices is carried out to provide theoretical support for device fabrication. Then, compatible with established epitaxial and device manufacturing technology on SiC substrate, GaN devices are fabricated on diamond-SiC composite substrates. A 52.5 °C reduction in surface temperature and about 41 % reduction in thermal resistance of the improved heat dissipation structures are exhibited, by contrast with GaN-on-SiC technology at base temperature of Tb = 25 °C and dissipation power of Pdiss = 7.2 W mm−1. The stable output characteristics and reliability of GaN-on-diamond/SiC structures are confirmed at high temperatures. This work is anticipated to afford a promising heat dissipation strategy for devices with high power density and illuminate a new perspective on exploring and constructing novel composite substrates with diamond. 

Diamond-SiC composite substrates: A novel strategy as efficient heat sinks for GaN-based devices

Cu-Fe-P immiscible alloys characterized by heterogeneous lamellar structure were manufactured by laser powder bed fusion (LPBF) and the deformation behavior of LPBF-produced immiscible alloys was investigated systematically. When the linear energy density of 133 J/m is adopted during LPBF, the immiscible alloy exhibits the highest compressive strength (~1 GPa) and engineering strain (~27%). The high strength of the LPBF-produced immiscible alloy is attributed to the heterogeneous lamellar structure including the interconnected Fe2P layer and nano-Fe2P particles as “hard” phase dispersed in the ε-Cu matrix as the “soft” phase. Moreover, the good ductility is attributed to the fine ε-Cu grains as “soft” phase precipitated within the lamellar Fe2P due to the secondary liquid phase separation (SLPS). This “soft-hard-soft” heterogeneous microstructure can effectively delay crack growth to exhibit excellent mechanical properties in the LPBF-produced immiscible alloys. 

Deformation behavior of heterogeneous lamellar Cu-Fe-P immiscible alloys with enhanced strength and ductility produced by laser powder bed fusion

Effects of different binder systems on the characteristics of metal-based diamond composites fabricated via fused deposition modeling and sintering technology

Co-based diamond tools are widely appreciated for their exceptional mechanical properties and good holding ability for diamonds. However, the reliance on cobalt (Co) poses challenges due to its high cost and scarcity as a strategic resource. A potential alternative is the Fe–Co–Cu alloy, emerging as a promising substitute for Co matrix alloys. In this work, hot-press sintering was utilized to create pure matrix and diamond tools utilizing Fe–Co–Cu pre-alloyed powders of varying compositions as raw materials without the use of any sintering additives. The investigation explores the influence of different Fe: Cu ratios on the mechanical properties of diamond tools produced from Fe–Co–Cu alloys, focusing on the diamond holding force, microstructure, and phase structure evolution. Results indicate that at a Co content of 15 wt% and Fe: Cu ratios ranging from 7.5:1 to 1:7.5, the Fe–Co–Cu alloy's phase structure primarily comprises α-Fe and a Cu-rich phase. Co predominantly exists in α-Fe as a solid solution. As the Fe: Cu ratio decreases, the alloy's phase structure gradually transitions from α-Fe to a Cu-rich phase, accompanied by a progressive decline in both bending strength and hardness, while the densities gradually increase. The matrix's holding force on the diamond exhibits an increasing and then diminishing trend, peaking at the Fe: Cu ratio of 6:1. The Fe–Co–Cu alloy sintered by hot-pressing has a nearly equiaxed grain structure with no obvious texture. 

Effect of Fe: Cu ratio on microstructure and mechanical properties of Fe-Co-Cu-based diamond tools

Effect of Cu-15Sn on the microstructure and mechanical properties of pressureless sintered Fe-Co-Cu alloy

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Effect of Cu-15Sn on the microstructure and mechanical properties of pressureless sintered Fe-Co-Cu alloy