The continuous increase in GPU performance benefits a wide range of high-performance computing (HPC) applications. Slower growth of transistor density and limited size of chip die are now posing significant challenges to scale GPUs. The chiplet technology provides a potential solution to surpass these limitations. However, the performance of these chiplet-based GPUs is often constrained by the metallic-based interconnects between the chiplets. Emerging technologies such as photonic interconnect can overcome the limitations of metallic interconnects, offering several superior properties, such as high bandwidth density and low energy consumption. In this paper, we propose SEECHIP: a Scalable and Energy-Efficient CHIPlet-based GPU architecture using photonic links. SEECHIP introduces a novel photonic inter-chiplet network that supports both unicast and broadcast communication, providing the same transmission bandwidth at both the sending and receiving ends. In addition, we propose a tailored hierarchical memory architecture, which is more suitable for the parallelization of general-purpose HPC applications. Simulation results using 14 benchmarks show that SEECHIP can achieve and reduction in execution time and energy consumption, respectively, as compared to other GPUs with metallic or photonic interconnects. Simulation results also show that SEECHIP has good scalability compared with the other GPUs.

SEECHIP: A Scalable and Energy-Efficient Chiplet-based GPU Architecture Using Photonic Links

Focusing through Scattering Media Using Integrated Photonics

In the rapidly evolving field of integrated photonics, integrated microwave photonics (MWP) stands out as a critical domain for on-chip signal processing applications. Over the past decade, harnessing stimulated Brillouin scattering (SBS) has yielded remarkable progress in this area due to its frequency tunability and unique narrowband resolution that can be achieved in a small footprint. The present article offers a comprehensive review of recent research focused on Brillouin scattering in photonic integrated circuits that guide light and sound, with a specific emphasis on heterogeneous and hybrid integration techniques tailored for applications in microwave photonics. The methodologies for realizing Brillouin hybrid circuits not only enable the seamless integration of Brillouin functions into complementary metal-oxide-semiconductor CMOS-compatible circuits but also facilitate the amalgamation of various active and passive functionalities on a single chip. Our discussion encompasses an overview of the strategies employed in harnessing Brillouin interactions, along with an examination of the associated challenges and limitations. Furthermore, we delve into both the existing and potential applications of this technology within the MWP systems domain, underscoring its multifaceted impact on contemporary research and future technological landscapes. 

Heterogeneous and hybrid integration for Brillouin microwave photonics

Silicon nitride is used for its low optical loss and high thermal stability, making it a suitable platform for visible-light applications in integrated photonic devices. However, its application has been limited due to inefficient light emission, a problem addressed by integrating various types of light emitters onto the platform. In particular, the integration of solution-processable colloidal nanocrystals (NCs) as optical gain materials onto the silicon nitride platform is a promising route but requires a more solid theoretical footing. By leveraging 2D surface-emitting photonic crystal structures combined with NCs, we effectively confine and manipulate light to achieve lasing from green to red. Building on this, we model the light–matter interactions of the low index contrast NC/nitride platform, validated by extensive experimental validations through Fourier imaging techniques, revealing the full photonic band structure and showing clear mode congestion. These comprehensive studies confirm the potential of hybrid NC-based structures for fully integrated on-chip laser applications and indicate routes for further improvement. 

Unraveling the Nature of Lasing Emission from Hybrid Silicon Nitride and Colloidal Nanocrystal Photonic Crystals with Low Refractive Index Contrast

硅基光电子芯片集成的胶体量子点有源器件（特邀）

We present the current state of the art in micro-transfer printing for heterogeneously integrated silicon photonic integrated circuits. The versatility of the technology is highlighted, as is the way ahead to make this technology a key enabler for next-generation photonic systems-on-chip.

Present and future of micro-transfer printing for heterogeneous photonic integrated circuits

This article introduces the photonic network-on-wafer graphics processing unit (GPU) architecture to overcome fundamental limitations in electrical interconnect scaling by implementing the inter-GPU network in a wafer-scale optical interposer. We argue that the photonic-NoW GPU is a scalable architecture, delivering significant performance benefits in a power-efficient manner.

Photonic Network-on-Wafer for Multichiplet GPUs

Grating coupler design for VCSELs heterogeneously integrated on silicon nitride

Electronic-Photonic Integrated Circuits through Micro-Transfer Printing

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Present and future of micro-transfer printing for heterogeneous photonic integrated circuits

Photonic Network-on-Wafer for Multichiplet GPUs

Grating coupler design for VCSELs heterogeneously integrated on silicon nitride

Electronic-Photonic Integrated Circuits through Micro-Transfer Printing