An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

An object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.

Semiconductor device and display device

To provide a semiconductor device and a display device which can be manufactured through a simplified process and the manufacturing technique. Another object is to provide a technique by which a pattern of wirings or the like which is partially constitutes a semiconductor device or a display device can be formed with a desired shape with controllability.

Semiconductor device, electronic device, and method of manufacturing semiconductor device

A radio frequency integrated circuit (RFIC) tag consisting of an 8 bit CPU, a 4 kB ROM, a 512B SRAM, and an RF circuit, which communicates using 915 MHz UHF RF signals, has been developed on both a flexible substrate and a glass substrate. Each of the RFIC tags employs a single DES and an anti-side channel attack routine in firmware for secured communication, and occupies an area of 10.5 mm in width and 8.9 mm in height. The RFIC tag on the flexible substrate is 145 mum thick and weighs 262 mg, and the RFIC tag on the glass substrate consumes 0.54 mW at a power supply voltage of 1.5 V and communicates with a maximum range of 43 cm at a power of 30 dBm. The high-performance poly-silicon TFT technology on flexible substrate and glass substrate of 0.8 mum design rule, and a gate plus one metal layer are used for fabrication. The RFIC tag realizes stable internal clock generation and distribution by a digital control clock generator and a two-phase nonoverlap clock scheme, respectively.

UHF RFCPUs on Flexible and Glass Substrates for Secure RFID Systems

In this paper, a review of the authors' work on inkjet-printed flexible antennas, fabricated on paper substrates, is given. This is presented as a system-level solution for ultra-low-cost mass production of UHF radio-frequency identification (RFID) tags and wireless sensor nodes (WSN), in an approach that could be easily extended to other microwave and wireless applications. First, we discuss the benefits of using paper as a substrate for high-frequency applications, reporting its very good electrical/dielectric performance up to at least 1 GHz. The RF characteristics of the paper-based substrate are studied by using a microstrip-ring resonator, in order to characterize the dielectric properties (dielectric constant and loss tangent). We then give details about the inkjet-printing technology, including the characterization of the conductive ink, which consists of nano-silver particles. We highlight the importance of this technology as a fast and simple fabrication technique, especially on flexible organic (e.g., LCP) or paper-based substrates. A compact inkjet-printed UHF ldquopassive RFIDrdquo antenna, using the classic T-match approach and designed to match the IC's complex impedance, is presented as a demonstration prototype for this technology. In addition, we briefly touch upon the state-of-the-art area of fully-integrated wireless sensor modules on paper. We show the first-ever two-dimensional sensor integration with an RFID tag module on paper, as well as the possibility of a three-dimensional multilayer paper-based RF/microwave structure.

/pdf/conductive-inkjet-printed-antennas-on-flexible-low-cost-5wj6ez72jl.pdf

Conductive Inkjet-Printed Antennas on Flexible Low-Cost Paper-Based Substrates for RFID and WSN Applications

On the basis of the fabrication of a CPU on glass as a digital circuit presented in B Lee et al (2003) and T Ikeda et al (2004), as well as the fabrication of a flexible CPU using a TFT transfer technology presented in T Takayama et al (2004), we have succeeded in the development of the world's first flexible RFCPUs (8bit, passive type) by adding to the CPU an antenna, an analog circuit, an encryption function and an RFID function, which operate using an RF signal with a frequency of 1356MHz

RFCPUs on glass and plastic substrates fabricated by TFT transfer technology

Eight-bit CPU with Nonvolatile Registers Capable of Holding Data for 40 Days at 85°C Using Crystalline In-Ga-Zn Oxide Thin Film Transistors

A flexible RFID tag communicates using UHF RF signals at 915MHz, consists of an 8b CPU, and employs a DES and anti-side channel attack routine in firmware. The tag realizes stable clock generation by a digital control clock generator, and occupies an area of 10.5 times 8.9mm2, is 145mum thick, consumes 0.54mW at 1.5V supply, and communicates with a maximum range of 43cm at a power of 9dBm.

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RFCPUs on glass and plastic substrates fabricated by TFT transfer technology

UHF RFCPUs on Flexible and Glass Substrates for Secure RFID Systems

Eight-bit CPU with Nonvolatile Registers Capable of Holding Data for 40 Days at 85°C Using Crystalline In-Ga-Zn Oxide Thin Film Transistors

UHF RFCPUs on Flexible and Glass Substrates for Secure RFID Systems