Antenna-in-package (AiP) technology, in which there is an antenna (or antennas) with a transceiver die (or dies) in a standard surface-mounted device, represents an important antenna and packaging technology achievement in recent years. AiP technology has been widely adopted by chipmakers for 60-GHz radios and gesture radars. It has also found applications in 77-GHz automotive radars, 94-GHz phased arrays, 122-GHz imaging sensors, and 300-GHz wireless links. It is believed that AiP technology will also provide elegant antenna and packaging solutions to the fifth generation and beyond operating in the lower millimeter-wave (mmWave) bands. Thus, one can conclude that AiP technology has emerged as the mainstream antenna and packaging technology for various mmWave applications. This article will provide an overview of the development of AiP technology. It will consider antennas, packages, and interconnects for AiP technology. It will show that the antenna choice is usually based on those popular antennas that can be easily designed for the application, that the package choice is governed for automatic assembly, and that the materials and processes choices involve tradeoffs among constraints, such as electrical performance, thermal–mechanical reliability, compactness, manufacturability, and cost. This article also shows a probe-based setup to measure mmWave AiP impedance and radiation characteristics. It goes on to give AiP examples implemented, respectively, in a low-temperature co-fired ceramic, an embedded wafer level ball grid array process, and a high-density interconnect processes. Finally, this article will summarize and present some recommendations on research topics to further the state of the art of AiP technology.

An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices

This article presents the first 39-GHz phased-array transceiver (TRX) chipset for fifth-generation new radio (5G NR). The proposed transceiver chipset consists of 4 sub-array TRX elements with local-oscillator (LO) phase-shifting architecture and built-in calibration on phase and amplitude. The calibration scheme is proposed to alleviate phase and amplitude mismatch between each sub-array TRX element, especially for a large-array transceiver system in the base station (BS). Based on LO phase-shifting architecture, the transceiver has a 0.04-dB maximum gain variation over the 360° full tuning range, allowing constant-gain characteristic during phase calibration. A phase-to-digital converter (PDC) and a high-resolution phase-detection mechanism are proposed for highly accurate phase calibration. The built-in calibration has a measured accuracy of 0.08° rms phase error and 0.01-dB rms amplitude error. Moreover, a pseudo-single-balanced mixer is proposed for LO-feedthrough (LOFT) cancellation and sub-array TRX LO-to-LO isolation. The transceiver is fabricated in standard 65-nm CMOS technology with flip-chip packaging. The 8TX–8RX phased-array transceiver module 1-m OTA measurement supports 5G NR 400-MHz 256-QAM OFDMA modulation with −30.0-dB EVM. The 64-element transceiver has a EIRPMAX of 53 dBm. The four-element chip consumes a power of 1.5 W in the TX mode and 0.5 W in the RX mode.

/pdf/a-39-ghz-64-element-phased-array-transceiver-with-built-in-4dctytp6vh.pdf

A 39-GHz 64-Element Phased-Array Transceiver With Built-In Phase and Amplitude Calibrations for Large-Array 5G NR in 65-nm CMOS

A 144-element phased array transceiver is realized using a modular tiled approach that supports 802.11ad, MCS12 single carrier 16-quadratic-amplitude modulation (QAM) 4.6 Gbps, in the 60-GHz band. It consists of a system-on-a chip (SOC) (MAC/PHY/BB to IF) in 28-nm CMOS, and one IF-to-60-GHz transceiver master chip driving twelve 60-GHz phased array transceiver slave chips fabricated in a 40-nm CMOS. Using the master-slave configuration, the 60-GHz transceiver with 12 phase-controlled TX/RX slices is expanded to 144 phase-controlled slices. Each final TX/RX slice is then connected to two patch antennas on LTCC substrate. A tiled approach is used to create the 288 patch antenna array out of six identical tiles each with two slave 60-GHz transceivers connected to a 48-element antenna array. The single tile phased array with 48 antennas has a measured beam steering scan angle of 60° in azimuth and 10° in elevation. The full phased array transceiver with 288 antennas has a measured over the air (OTA) max effective isotropic radiated power (EIRP) of 51 dBm at saturated power (PSAT), and EIRP of 44.8 dBm with −22 dB EVM for MCS12 (16QAM-4.6 Gbps) at broadside. It has an OTA measured sensitivity of −87.3 and −80.4 dBm for MCS9 (QPSK-2.5 Gbps) and MCS12, respectively, at broadside. A packet error rate of 10−5 was measured for MCS9 and MCS12 with an OTA input power of −85 and −77.5 dBm, respectively, for the full phased array transceiver at broadside.

A 60-GHz 144-Element Phased-Array Transceiver for Backhaul Application

The fifth generation (5G) research and development has been fueled by many new breakthroughs in various areas. The recent progress in carrier aggregation (CA), licensed assisted access (LAA), massive MIMO (MaMi), beamforming techniques, cooperative spectrum sensing (CSS), compressive sensing (CS), machine learning, etc., has provided inspiring and promising approaches to address 5G and beyond challenges. However, at the user equipment (UE) end, limited design budget and hardware resources bring along a series of challenging implementation issues when delivering multi-standard and multi-functional wireless communications. In this paper, we first review recent advances in technical standards and critical enabling techniques, accompanied with several case studies of product developments. After the classification of typical 5G application and deployment scenarios, we propose and analyze a novel hardware reuse and multiplexing solution to facilitate cost-effective and energy-efficient UE design, followed by an investigation of state-of-the-art hardware development from the systems and circuits standpoint. Moreover, wireless UE hardware solutions, UE proof-of-concept (PoC) implementation and field test are proposed and discussed. Finally, the new trends of UE design and terahertz technologies for 5G and beyond applications are investigated and envisioned.

/pdf/enabling-multi-functional-5g-and-beyond-user-equipment-a-10lgjh6d0f.pdf

Enabling Multi-Functional 5G and Beyond User Equipment: A Survey and Tutorial

This paper presents a multi-standard fully connected hybrid beamforming (FC-HBF) receiver that can be reconfigured between two fully connected two-stream multi-input-multi-output (MIMO) modes at 28- or 37-GHz band, and an inter-band carrier-aggregation (CA) mode enabling concurrent single-stream operation at 28 and 37 GHz. A new image-reject (IR) heterodyne beamforming architecture is introduced that facilitates easy reconfiguration. Concurrent dual-band operation of the beamformer front end is achieved by using an inherently wideband Cartesian-combining-based RF-domain complex-weighting architecture, which is implemented using coupled-resonator-based dual-band gain stages, and current-mode dual-band active combiners. The downconversion stage comprises a cascade of complex-quadrature mixing stages that combines Cartesian complex-weighting operation with image rejection. A new quadrature error detection and calibration scheme is also introduced to improve the image rejection of the proposed architecture. A minimum mean-square error (MMSE) beam adaptation technique, introduced for the first time in an RF or hybrid beamformer, breaks the need for individual access to the beamformer inputs needed in a traditional least-mean-square (LMS) scheme and allows both main lobe and null adaptation. A 28-/37-GHz hybrid beamforming receiver with four antenna inputs and two baseband output streams is designed in 65-nm CMOS that demonstrates the above features. In each antenna path, the receiver achieves 33-dB (26.5 dB) peak conversion gain, 2.75-GHz (3.75 GHz) RF bandwidth, and 5.7-dB (8.5 dB) NF at 28 GHz (37 GHz). The entire receiver consumes 310 mW and occupies 2.2 mm2 core area. Extensive characterization results for single-element and several multi-element scenarios are presented including concurrent dual-band receiving (>35-dB image rejection), null-steering (>25-dB peak to null for two elements), and multi-element CA (~50-dB inter-carrier interference rejection).

A Reconfigurable 28-/37-GHz MMSE-Adaptive Hybrid-Beamforming Receiver for Carrier Aggregation and Multi-Standard MIMO Communication

The 802.11ad standard (WiGig) provides throughput speeds of multi-Gb/s covering tens of meters and uses beamforming in the four 2GHz-wide channels in the 60gHz ISM band. Conventional backhaul solutions, on the other hand, are designed with high gain directional antennas with no electronic beam steering and have high cost for installation and alignment of antennas. This paper presents a full-featured 802.11ad chipset with 144-element phased array using a tiled approach and CMOS IPs developed for WiGig to address low-cost municipal WiFi, small-cell backhauling, and broadband to home covering the last mile. Designed with a link budget of 120dB+, the phased-array solution can be mounted on top of lamp posts and roof-top buildings covering a 200m LOS, and with tens of hops a range of 2km can be covered from a single point of fiber. Moreover, the steerable phased arrays enable dynamic routing optimization between hopping nodes in a mesh network.

A 60GHz 144-element phased-array transceiver with 51dBm maximum EIRP and ±60° beam steering for backhaul application

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A 60GHz 144-element phased-array transceiver with 51dBm maximum EIRP and ±60° beam steering for backhaul application