Asymptotical synchronization for chaotic Lur’e systems using sampled-data control

Singular reduced-order observer-based synchronization for uncertain chaotic systems subject to channel disturbance and chaos-based secure communication

With the rapid development of 5G communications, the traditional interlayer dielectric material polyimide (PI) requires modification due to its intrinsically high dielectric constant (Dk), high dielectric loss (Df), and high moisture absorption, which make it difficult to meet the needs of the high-frequency communications industry. In this paper, a new strategy for the preparation of novel PI with intrinsically low Dk and Df is proposed from the perspective of molecular structure design, the modification effect of superimposing bulky triphenyl pyridine structures and strong electronegativity groups, combined with long-chain anhydride to reduce the density of the imide structure. Therefore, three bulk diamine monomers (BPAB, PBAB3F, PBAB6F) containing triphenyl pyridine structures were designed in this paper and polymerized with 4,4′-(4,4′-isopropyldiphenoxy) phthalic anhydride (BPADA) to obtain three new PIs (PI-H, PI-CF3, PI-2CF3) with different fluorine contents, focusing on the relationship between structure and properties, especially the effect of fluorine content on dielectric properties. The results of the study show that the dielectric and hygroscopic properties of PI improve with increasing fluorine content. Among them, PI-2CF3 has the best overall performance, showing low dielectric (Dk = 2.72@10 GHz & Df = 0.00233@10 GHz), high transparency (Cut-off wavelength (λ0) = 389 nm, Maximum transmittance (Tvia) = 89%) and low hygroscopicity (Water absorption (Ma) = 0.246%, Contact angle (Ca) = 111°). 

Fluorinated polyimide with triphenyl pyridine structure for 5G communications: low dielectric, highly hydrophobic, and highly transparent

An improved fragmentation approach to sampled-data synchronization of chaotic Lur’e systems

Low-dielectric polyimide constructed by integrated strategy containing main-chain and crosslinking network engineering

Progress in low dielectric polyimide film – A review

Impulsive synchronization for a chaotic system with channel time-delay

Currently, heat accumulation has seriously affected stabilities and life of electronic devices. Polyimide (PI) film with high thermal conductivity coefficient (λ) has long been held up as an ideal solution for heat dissipation. Based on the thermal conduction mechanisms and classical thermal conduction models, this review presents design ideas of PI films with microscopically ordered liquid crystalline structure which are of great significance for breaking the limit of λ enhancement and describes the construction principles of thermal conduction network in high-λ filler strengthened PI films. Furtherly, the effects of filler type, thermal conduction paths and interfacial thermal resistances (ITR) on thermally conductive behavior of PI film are systematically reviewed. Meanwhile, this paper summaries the reported research and provides an outlook on the future development of thermally conductive PI films. Finally, it is expected that this review will give some guidance to the future studies in thermally conductive PI film. This article is protected by copyright. All rights reserved.

Structural Design and Research Progress of Thermally Conductive Polyimide Film - A Review.

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Progress in low dielectric polyimide film – A review

Impulsive synchronization for a chaotic system with channel time-delay

Structural Design and Research Progress of Thermally Conductive Polyimide Film - A Review.