Emerging challenges and materials for thermal management of electronics

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

The depletion of the world's limited reservoirs of fossil fuels, the worldwide impact of global warming and the high cost of energy are among the primary issues driving a renewed interest in the capture and reuse of waste energy. A major source of waste energy is being created by data centers through the increasing demand for cloud based connectivity and performance. In fact, recent figures show that data centers are responsible for more than 2% of the US total electricity usage. Almost half of this power is used for cooling the electronics, creating a significant stream of waste heat. The difficulty associated with recovering and reusing this stream of waste heat is that the heat is of low quality. In this paper, the most promising methods and technologies for recovering data center low-grade waste heat in an effective and economically reasonable way are identified and discussed. A number of currently available and developmental low-grade waste heat recovery techniques including district/plant/water heating, absorption cooling, direct power generation (piezoelectric and thermoelectric), indirect power generation (steam and organic Rankine cycle), biomass co-location, and desalination/clean water are reviewed along with their operational requirements in order to assess the suitability and effectiveness of each technology for data center applications. Based on a comparison between data centers' operational thermodynamic conditions and the operational requirements of the discussed waste heat recovery techniques, absorption cooling and organic Rankine cycle are found to be among the most promising technologies for data center waste heat reuse.

A review of data center cooling technology, operating conditions and the corresponding low-grade waste heat recovery opportunities

Computer assisted surgical planning and image guided technology have become increasingly used in neurosurgery. We have developed a system based on ATmC (Adaptive Template moderated Classification) for the automated segmentation of 3D MRI brain data sets of patients with brain tumors (meningiomas and low grade gliomas) into the skin, the brain, the ventricles and the tumor. In a validation study of 13 patients with brain tumors, the segmentation results of the automated method are compared to manual segmentations carried out by 4 independent trained human observers. It is shown that the automated method segments brain and tumor with accuracy comparable to the manual method and with improved reproducibility.

Medical Image Computing and Computer-Assisted Intervention – MICCAI’99

This paper reports the development of a robotic system designed to extend a human’s ability to perform small-scale (sub-millimeter) manipulation tasks requiring human judgment, sensory integration,...

A Steady-Hand Robotic System for Microsurgical Augmentation

System-on-Package (SOP) technology based on silicon carriers has the potential to provide modular design flexibility and high-performance integration of heterogeneous chip technologies and to support robust chip manufacturing with high-yield/low-cost chips for a wide range of two- and three-dimensional product applications. Key technology enablers include silicon through-vias, high-density wiring, high-I/O chip interconnection, and supporting test and assembly technologies. The silicon through-vias are a key feature permitting efficient area array signal, power, and ground interconnection through these thinned silicon packages. High-density wiring and high-density chip I/O interconnection can enable tight integration of heterogeneous chip technologies which approximate the performance of an integrated system-on-chip with a "virtual chip" using the silicon package for integration. Silicon carrier fabrication leverages existing manufacturing capability and mid-UV lithography to provide very dense package wiring following CMOS back-end-of-line design rules. Further, the thermal expansion of the silicon carrier package matches the chip, which helps maintain reliability even as the high-density chip microbump interconnections scale to smaller size. In addition to heterogeneous chip integration, SOP products may leverage the integration of passive components, active devices, and electro-optic structures to enhance system-level performance while also maintaining functional test capability and known good chips when needed. This paper describes the technical challenges and recent progress made in the development of silicon carrier technology for potential new applications.

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

The keyboard assembly for a computer with movable keyboard pallets. The pallets are movable relative to each other between a compact stowing position and an extended operational position. A movement mechanism moves at least one of the pallets in a lateral direction relative to the other pallet and then towards the other pallet in a direction orthogonal to the lateral direction. The movement mechanism can be connected to the cover of the computer to automatically control movement of the pallets based upon position of the cover relative to a base of the computer. Thus, the pallets can be automatically moved from the compact stowing position, when the cover is closed, to the extended operational position when the cover is opened. Upon moving the cover from the open position to the closed position, the pallets are automatically moved from the extended operational position to the compact stowing position.

Keyboard with translating sections

A computer system includes a chassis and a cartridge having separate functional components that interface with one another over a common bus. The chassis includes a plurality of user interface modules, which are generally designed and packaged according to a particular application/work mode, each coupled to a first bus. The cartridge, on the other hand, includes components that can be shared among the various applications/work modes. Specifically, the cartridge has a core processor and memory coupled to a second bus, and at least one slot for housing a communication module that is coupled to the second bus. In addition, the cartridge may be designed to be configured by the user to have a first form and a second form. The cartridge of the first form may be utilized for portable computer processing systems such as laptop, notebook and sub-notebook systems. The cartridge of the second form may be designed to be narrow enough to be utilized in smaller portable computer processing systems, such as hand-held systems.

A cartridge-based design for portable and fixed computers

A wireless handset phone, virtual image display coupled to the wireless handset phone and pointing device for pointing on the virtual image display are included. The communicator may also include a limited-function computer. The virtual image display uses optics to create the virtual image. The pointing device may include a virtual selector; that is, an array of sensors or switches to accommodate different users's hands.

Personal communicator including a handset phone with an integrated virtual image display

We have designed a robotic arm based on a double parallel four bar linkage to act as an assistant in minimally invasive surgical procedures. The remote center of motion (RCM) geometry of the robot arm kinematically constraints the robot motion such that minimal translation of an instrument held by the robot takes place at the entry portal into the patientApos;s body. In addition to the two rotational degrees of freedom comprising the RCM arm, distal translation and rotation are provided to manoeuver the instrument within the patient's body about an axis coincident with the RCM. An XYZ translation stage located proximal to the RCM arm provides positioning capability to establish the RCM location relative to the patients anatomy. An electronics set capable of controlling the system, as well as performing a series of safety checks to verify correct system operation, has also been designed and constructed. The robot is capable of precise positional motion. Repeatability in the ±10 micron range is demonstrated. The complete robotic system consists of the robot hardware and an IBM PC-AT based servo controller connected via a custom shared memory link to a host IBM PS/2. For laparoscopic applications, the PS/2 includes an image capture board to capture and process video camera images. A camera rotation stage has also been designed for this application. We have successfully demonstrated this system as an assistant in a laparoscopic cholecystectomy. Further applications for this system involving active tissue manipulation are under development.

https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S0263574700018981

A remote center of motion robotic arm for computer assisted surgery

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