George Frederick Walker
IBM
82 Papers
4.1K Citations
George Frederick Walker is an academic researcher from IBM. The author has contributed to research in topics: Layer (electronics) & Integrated circuit. The author has an hindex of 33, co-authored 82 publications.
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Papers
Patent
Radio frequency identification tag
Michael John Brady,Thomas Anthony Cofino,Harley Kent Heinrich,Glen Walden Johnson,Paul A. Moskowitz,George Frederick Walker +5 more
- 20 Dec 2012
TL;DR: In this article, a sensor system (1000) comprises a tag (100) consisting of at least one radio-frequency chip (130) having a memory element, an antenna (140) disposed in electrical communication with output terminals of the chip and a non-conductive coating (115) disposed upon a surface of the tag.
443
Patent
Silicon chip carrier with conductive through-vias and method for fabricating same
Daniel C. Edelstein,Paul S. Andry,Leena Paivikki Buchwalter,Jon A. Casey,Sherif A. Goma,Raymond Robert Horton,Gareth G. Hougham,Michael Lane,Xiao Hu Liu,Chirag S. Patel,Edmund J. Sprogis,Michelle L. Steen,Brian R. Sundlof,Cornelia K. Tsang,George Frederick Walker +14 more
- 05 Dec 2003
TL;DR: A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is more than or close to the substrate.
257
Patent
Three dimensional high performance interconnection package
Brian Samuel Beaman,Fuad E. Doany,Keith E. Fogel,James L. Hedrick,Paul A. Lauro,Maurice Heathcote Norcott,John J. Ritsko,Leathen Shi,Da-Yuan Shih,George Frederick Walker +9 more
- 19 Oct 1992
TL;DR: In this paper, an elastomeric interposer is constructed from a thermally conductive material such as diamond and a heat dissipation means is thermally connected to the edges of the substrate to extract heat generated within the structure.
209
Patent
Method for forming Co-W-P-Au films
Carlos J. Sambucetti,Judith M. Rubino,Daniel C. Edelstein,Cyryl Cabral,George Frederick Walker,John G. Gaudiello,Horatio S. Wildman +6 more
- 27 Sep 2001
TL;DR: In this paper, a quaternary alloy film of Co-W-P-Au for use as a diffusion barrier layer on a copper interconnect in a semiconductor structure and devices formed incorporating such film are disclosed.
200
Patent
Semiconductor wafer test and burn-in
James M. Leas,Robert William Koss,Horn Jody Van,George Frederick Walker,Charles Hampton Perry,David L. Gardell,Steve Leo Dingle,Ronald J. Prilik +7 more
- 09 Aug 1996
TL;DR: In this article, an apparatus and a method for simultaneously testing or burning in all the integrated circuit chips on a product wafer is presented. But the apparatus comprises a glass ceramic carrier having test chips and means for connection to pads of a large number of chips on an integrated circuit wafer.
183