https://tandfonline.com/doi/pdf/10.1080/14686996.2019.1591168

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Sn-based lead-free solder alloys have been investigated widely to replace the traditional Sn–Pb solder alloys. Since the miniaturization of electronic products and the expansion of application field, the corrosion resistance of solder alloys play a key factor in the reliability of electronic products in long-term service. In this article, we review the recent progress on the corrosion behavior of Sn-based lead-free solder alloys by summarizing the results in representative ones of Sn–Bi, Sn–Cu, Sn–Zn, Sn–Ag, Sn–Ag–Cu and other multi-elements lead-free solder alloys. Specifically, the relationship between microstructure morphology and corrosion behavior, the corrosion mechanism of Sn-based lead-free solder alloys after incorporation of alloy elements or particles are summarized. It is hoped that this overview will provide some useful information in clarifying the corrosion mechanism and development of lead-free solder alloys. Furthermore, remaining difficulties and future trends in this research field are proposed.

Corrosion behavior of Sn-based lead-free solder alloys: a review

Development of lead-free interconnection materials in electronic industry during the past decades: structure and properties

In the search for applications for alloys developed under the philosophy of the High Entropy Alloy (HEA)-type materials, the focus may be placed on applications where current alloys also use multiple components, albeit at lower levels than those found in HEAs. One such area, where alloys with complex compositions are already found, is in filler metals used for joining. In soldering ( 450 °C), filler metal alloys are taken above their liquidus temperature and used to form a metallic bond between two components, which remain both unmelted and largely unchanged throughout the process. These joining methods are widely used in applications from electronics to aerospace and energy, and filler metals are highly diverse, to allow compatibility with a broad range of base materials (including the capability to join ceramics to metals) and a large range of processing temperatures. Here, we review recent developments in filler metals relevant to High Entropy materials, and argue that such alloys merit further exploration to help overcome a number of current challenges that need to be solved for filler metal-based joining methods.

https://www.mdpi.com/1099-4300/23/1/78/pdf

High Entropy Alloys as Filler Metals for Joining.

Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder

The corrosion behavior of Sn–0.7Cu–xP (x = 0, 0.1, 0.3, 0.5) solder alloy in the aggressive environment was investigated by potentiodynamic polarization and weight loss method. Scanning electron microscope (SEM) was used to observe the morphology of Sn–0.7Cu–xP solder alloys and X-ray diffraction (XRD) was applied to characterize the phases formed on the surface after corrosion. The results indicate that phosphorus (P) can enhance the corrosion resistance of Sn–0.7Cu solder alloy whether in acidic or in alkaline solution, and its corrosion resistance increases with increasing P. The corrosion resistance of the solder alloy is better in alkaline solution compared to that in acidic solution. The morphology observation also shows that the incorporation of P into Sn–0.7Cu alloy can obviously decrease the damage extent of the solder alloys. XRD analysis reveals that the corrosion products both in acidic and alkaline solution are Sn oxides.

Effects of Phosphorus Addition on the Corrosion Resistance of Sn–0.7Cu Lead-Free Solder Alloy

The effects of S addition on the corrosion behaviour of Sn-9Zn solders in 3.5 wt-% NaCl solution were investigated using dynamic potential polarisation, electrochemical impedance spectroscopy techniques and weight loss measurement. The results indicate that S addition could obviously improve the corrosion resistance of Sn-9Zn solder alloy as revealed by much lower corrosion current density, higher impedance and the reduced weight loss. It is believed that the homogeneous microstructures of Sn-9Zn, especially the black refined Zn-rich phases are favourable to improve its corrosion resistance. SEM observations found that S addition might promote the formation of denser and more uniform corrosion products on the solder surface. The main corrosion product was Zn5(OH)8Cl2·H2O determined by EDS and XRD analysis.

Corrosion behaviour of Sn-9Zn-xS solders in 3.5 wt-% NaCl solution

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Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder

Effects of Phosphorus Addition on the Corrosion Resistance of Sn–0.7Cu Lead-Free Solder Alloy

Corrosion behaviour of Sn-9Zn-xS solders in 3.5 wt-% NaCl solution