Prodn. of solderable thin film conductor tracks on a substrate involves the deposition of a Cr base layer, followed by a Cu oxide barrier layer by reactive deposition in an O2 atmos. and finally a Cu conductor track layer. The process is used in the mfr. of an integrated laminated or hybrid circuit with elements, esp. thin film resistors, on an electrically insulating substrate. Costs are reduced, since the use of a noble metal as diffusion barrier film is avoided.

Solderable thin film conductor prodn. for integrated circuit - by reactive deposition of copper oxide barrier on chromium base layer before copper plating

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Solderable thin film conductor prodn. for integrated circuit - by reactive deposition of copper oxide barrier on chromium base layer before copper plating