Coagulation and Flocculation in Water and Wastewater Treatment provides a comprehensive account of coagulation and flocculation techniques and technologies in a single volume covering theoretical principles to practical applications. Thoroughly revised and updated since the 1st Edition it has been progressively modified and increased in scope to cater for the requirements of practitioners involved with water and wastewater treatment. A thorough gamut of treatment scenarios is attempted, including turbidity, color and organics removal, including the technical aspects of enhanced coagulation. The effects of temperature and ionic content are described as well as the removal of specific substances such as arsenic and phosphorus. Chemical phosphorus removal is dealt with in detail, Rapid mixing for efficient coagulant utilization, and flocculation are dealt with in specific chapters. Water treatment plant waste sludge disposal is dealt with in considerable detail, in an Appendix devoted to this subject. Invaluble for water scientists, engineers and students of this field, Coagulation and Flocculation in Water and Wastewater Treatment is a convenient reference handbook in the form of numerous examples and appended information.

Coagulation and Flocculation in Water and Wastewater Treatment

A method of separating a thin film of GaN epitaxially grown on a sapphire substrate. The thin film is bonded to an acceptor substrate, and the sapphire substrate is laser irradiated with a scanned beam at a wavelength at which sapphire is transparent but the GaN is strongly absorbing, e.g., 248 nm. After the laser irradiation, the sample is heated above the melting point of gallium, i.e., above 30° C., and the acceptor substrate and attached GaN thin film are removed from the sapphire growth substrate. If the acceptor substrate is flexible, the GaN thin film can be scribed along cleavage planes of the GaN, and, when the flexible substrate is bent, the GaN film cleaves on those planes. Thereby, GaN lasers and other electronic and opto-electronic devices can be formed.

Separation of thin films from transparent substrates by selective optical processing

A review : On the development of low melting temperature Pb-free solders

The mechanical behavior of Sn-rich solder/Cu joints is highly sensitive to processing variables such as solder reflow time, cooling rate, and subsequent thermal aging. In this article, we focus on the lap shear behavior of Sn-3.5Ag/Cu joints as a function of solder yield strength and intermetallic thickness. Experimental results showed that the shear strength of the solder joints is primarily controlled by the mechanical properties of the solder, and not the intermetallic thickness. The thickness of intermetallic, however, controlled the fracture mode of the solder joints. At intermetallic thicknesses greater than 20 µm, brittle fracture between Cu6Sn5 and Cu3Sn was the most common failure mechanism. Finite-element simulations were carried out to evaluate the effect of solder properties and of intermetallic thickness and morphology on lap shear behavior. The finite-element simulations corroborated the experimental findings, i.e., that increased solder strength results in increased joint strength. The simulations also showed that thicker intermetallics, especially of nodular morphology, yielded higher local plastic shear strain and work hardening rate.

Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints

Polyferric sulphate: Preparation, characterisation and application in coagulation experiments

Elemental (X) additions to Sn-3.5Ag-0.95Cu (SAC3595) solder were developed with minimal (<0.25 wt.%) concentration to avoid pro-eutectic Ag3Sn blades by reducing undercooling (ΔT) and to eliminate thermal-aging-induced embrittlement. Calorimetry and microstructure results on simple Cu/Cu joints identified 0.21Zn, 0.10Mn, and 0.05Al as sufficient to reduce undercooling below that for SAC3595 and to eliminate Ag3Sn blades. A 211°C melting onset for the X = Mn alloys also suggested the discovery of a new quaternary eutectic. Shear testing and microstructure analysis of larger joints showed that 0.05Al and 0.21Zn additions resulted in reduced as-soldered strength (30 MPa), like Sn-0.95Cu, but all joints showed ductile failure at about 30 MPa after 1000 h at 150°C.

Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design

This paper proposes a new approach to synthesize polymeric ferric sulfate (PFC). It was found that the basicity and stability of the synthesized PFS varied with the quantity of sulfuric acid used. The minimum amount of sulfuric acid needed for the synthesis of PFS to insure a residual Fe\U2+\N concentration in the product lower than 0.1 wt% is about 31.0 wt% of the stoichiometric requirement. However, to produce a stable product which can be stored for six months, the amount of sulfuric acid should be 51.7 and 62.0 wt% of the stoichiometric requirement for PFS produced at 55 and 85°C, respectively. The structure of PFS depended on the synthesis temperature, as observed through x-ray diffraction and transmission electron microscopy. A comparison of the coagulation performance of PFS and ferric sulfate (FS) showed that PFS is, in general, more effective than FS in reducing the turbidity of Kaolinite suspensions for various conditions.

Synthesis, Characterization, and Coagulation of Polymeric Ferric Sulfate

We describe the use of the epitaxial lift-off technique to remove thin layers of InAs from the GaAs substrates on which they were grown and subsequently bonded to glass and silicon substrates. Lift-off was accomplished by taking advantage of the high etching selectivity between AlSb and InAs in an aqueous hydrofluoric acid etching solution, allowing a thin layer of AlSb to serve a sacrificial layer to facilitate the lift-off of the InAs. The InAs layers were transferred with little measurable effect on the electrical and structural properties of the films, as evidenced by Hall effect and x-ray measurements. The technique can easily be extended to transfer more-complex GaSb/AlSb/InAs structures.

Epitaxial lift-off of thin InAs layers

The shear deformation behavior of two lead-free solder compositions, Sn-3.5Ag (wt.%) and Sn-3.6Ag-1.0Cu (wt.%), both on copper substrates, was studied using an asymmetric four point bend technique. Four test joints were obtained from one master specimen of each composition, and each joint was subject to progressive loading, up to the maximum shear strength of the joint. One unstressed bar from each composition was retained as a reference. Each sample was metallo-graphically plished and lightly etched, and examined in a field emission scanning electron microscope (SEM) before shearing. Sheared joints were then re-examined in the SEM with no additional surface treatment. Compared with the traditional ring and plug method, the asymmetric four-point bend (AFPB) technique subjects the joints to a condition of pure shear, while providing an opportunity for unambiguous observation of microstructural features before and after shearing, without an intervening mechanical sectioning step. Shear banding in the Sn-rich matrix and crack nucleation in the vicinity of the intermetallic interface were observed at low displacements in the binary alloy. Evidence of non-homogeneous plastic flow in the matrix was seen at higher shear loading. No evidence of brittle fracture was observed in the Sn-3.6Ag-1.0 Cu alloy, with elastic deformation at low stress levels giving rise to plastic deformation at higher loading values. Results show that the AFPB technique is a viable approach to the study of shear loading on solder joints.

Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests

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Papers

Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design

Synthesis, Characterization, and Coagulation of Polymeric Ferric Sulfate

Epitaxial lift-off of thin InAs layers

Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests