The present paper aims to analyze the surface finish of polished silicon wafer by chemically etching with potassium hydroxide (KOH) and mechanical polishing by Double Disk Magnetic Abrasive Finishing (DDMAF) process. The study is emphasized to study the effect of process parameters i.e. polishing speed, working gap, abrasive mesh number and percentage weight of KOH on the surface roughness (Ra). Response surface methodology (RSM) has been used to plan the experiments and Analysis of variance (ANOVA) has been used to analyze the impact of each process parameter on surface roughness. Regression equation for surface roughness in terms of significant process parameters has been developed to determine the surface roughness of polished silicon wafer. The equation has been further optimized using optimizer available with Minitab 17 and Genetic Algorithm (GA) tool box available with MatLab 16, to obtain the optimum process parameters and to prefigure the minimum surface roughness. The confirmatory experiment was carried out at optimum parameters and the prefigured results were found to be closely matched with the experimental findings. The communication further vocalizes the study of surface integrity for the unpolished sample to polished sample at optimum parameter using SEM and AFM images.

Statistical Modeling and Surface Texture Study of Polished Silicon Wafer Si (100) using Chemically Assisted Double Disk Magnetic Abrasive Finishing

With the development of mould manufacturing industry, the high precision polishing technologies of Ni–P-coated SKD11 steel are in high demand. In this work, the factors influencing the magnetic material polishing process were determined by investigating the force distribution of carbonyl iron (CIPs) and abrasive particles (APs) in the working surface of magnetorheological fluid (MRF). The influence of certain factors, such as the diameters of the CIPs and the APs and the current and working distance (K), on the polishing surface quality, was assessed by fuzzy grey and Taguchi analysis. Results showed that the values of the fuzzy grey relationships with the surface quality of the factors were 0.4914, 0.7797, 0.6686 and 0.7461. Result showed that the fuzzy grey relationship point of factors known as diameters of the AGs had the most remarkable influence on the polishing effect, and the effect of CIP diameter was insignificant. The MRF contained commercially available CIPs that had been successfully applied for polishing the surface of magnetic materials with extremely high accuracy (surface roughness Ra = 0.561 nm) without leaving scratches on the surface after polishing.

Applying fuzzy grey relationship analysis and Taguchi method in polishing surfaces of magnetic materials by using magnetorheological fluid

Multi-pole arrangements in magnetorheological plane finishing technology have been investigated in this study. A method of combining the material removal mechanism of micro-points using the empirical Preston equation is proposed to establish a prediction model for surface flatness, and the new Semiconductor Equipment and Materials International (SEMI) standard has been used to evaluate workpiece surface flatness. Based on the model, the effects of process parameters (polishing time, speed ratio, translational amplitude, polishing gap, etc.) on the flatness of workpieces with different shapes are predicted through simulation, and the effects of multi-pole arrangements are explored. The results of the analysis indicate that with changes in process parameters, the extent of change in surface flatness differs based on the shape of the workpiece. After polishing, concave workpieces show the highest levels of surface flatness. From simulations of magnetic pole arrangements, it is also found that magnetic field generators with different magnetic pole arrangements can be used for workpieces with different shapes to improve their surface flatness. Experiments with a workpiece with its shape measured using a white light interferometer showed that the surface flatness improved from being 33.561 μm initially to 21.822 μm after polishing, thereby demonstrating the effectiveness of the proposed method.

Modeling and simulation of workpiece surface flatness in magnetorheological plane finishing processes

A magnetorheological finishing (MRF) method, which is named lap-MRF, is proposed in this paper. A lap, instead of a large polishing wheel, is used to expand the polishing area, which significantly improves the material removal rate. Lap-MRF uses the flexible magnetorheological fluid (MR fluid) as a polishing pad to match the surface well. Moreover, the MR fluid in the polishing zone can be renewed continuously to ensure the stability of the material removal rate. The principle of Lap-MRF and the theoretical model of the material removal rate are presented. The effects of the spindle speed and the working gap distance on the polishing normal pressure and the material removal rate are analyzed. Finally, a series of polishing experiments and simulations are carried out. The volume removal rate for K9 is up to 0.76  mm3  /  min and the comprehensive material removal stability is 6.7%. Using MATLAB simulation process method, the convergence efficiency for a ϕ1000  mm mirror is 98.5%. The results verify the validity of the proposed method.

Analysis of material removal rate and stability in lap-magnetorheological finishing

Review on high efficiency and high precision compliant polishing method

A novel magnetorheological finishing (MRF) method, which is named Lap-MRF, is proposed in this paper. The magnetorheological fluid (MR fluid) in the polishing zones can be renewed continuously so that the determinacy is ensured. A lap, instead of a large polishing wheel, is used to expand the polishing area, which improves the material removal rate largely. Lap-MRF uses flexible MR fluid as polishing pad to match the surface well. Moreover, the polishing pad executes planetary motion so as to obtain smooth surface. In this paper, the principle of Lap-MRF and the theoretical model of material removal rate are presented. Using the finite element analysis method, the permanent magnet unit is simulated and a multi-parameter optimization is conducted to improve the performance of Lap-MRF. Finally, a series of polishing experiments and simulation process are carried out. For K9 sample, the volume removal rate is up to 0.76 mm3/min and its relative change rate is less than 5.5%. For silicon modification layer sample, the surface roughness is improved to 0.788 nm RMS (root mean square) from 1.610 nm RMS. There is no deep pit and the polishing ripple is not apparent on the surface. For Φ1000 mm flat mirror, the convergence efficiency of simulation process is up to 97.2%. These results verify the validity of the proposed method, which makes Lap-MRF to be a promising finishing technology for large aperture mirrors.

A novel Lap-MRF method for large aperture mirrors

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A novel Lap-MRF method for large aperture mirrors