http://www.me.unm.edu/gradseminar/03312006.pdf

A homogenized free energy model for hysteresis in thin-film shape memory alloys

We report a novel packaging and experimental technique for characterizing thermal flow sensors at high temperatures. This paper first reports the fabrication of 3C-SiC (silicon carbide) on a glass substrate via anodic bonding, followed by the investigation of thermoresistive and Joule heating effects in the 3C-SiC nano-thin film heater. The high thermal coefficient of resistance of approximately −20 720 ppm/K at ambient temperature and −9287 ppm/K at 200 °C suggests the potential use of silicon carbide for thermal sensing applications in harsh environments. During the Joule heating test, a high-temperature epoxy and a brass metal sheet were utilized to establish the electric conduction between the metal electrodes and SiC heater inside a temperature oven. In addition, the metal wires from the sensor to the external circuitry were protected by a fiberglass insulating sheath to avoid short circuit. The Joule heating test ensured the stability of mechanical and Ohmic contacts at elevated temperatures. Using a hot-wire anemometer as a reference flow sensor, calibration tests were performed at 25 °C, 35 °C, and 45 °C. Then, the SiC hot-film sensor was characterized for a range of low air flow velocity, indicating a sensitivity of 5 mm−1 s. The air flow was established by driving a metal propeller connected to a DC motor and controlled by a microcontroller. The materials, metallization, and interconnects used in our flow sensor were robust and survived temperatures of around 200 °C.

/pdf/a-hot-film-air-flow-sensor-for-elevated-temperatures-1xqlsu52ue.pdf

A hot-film air flow sensor for elevated temperatures

Theoretical formulations of strain coefficient of resistance and resistivity in supported and unsupported thin metallic films are examined. The case of thermal strains is emphasised and an expression of the difference in TCR of supported and unsupported films is derived.

Thermal strains in thin metallic films

Alternating electric fields can align the smectic A side chain liquid crystalline polymer poly(M060NS) while it cools from the isotropic phase to the smectic phase, forming an optically transparent texture. The effect occurs only above a threshold electric field strength, and depends strongly on sample thickness and cooling rate, and weakly on electric field frequency. The aligned monodomain is stable up to the smectic-isotropic transition temperature (although there is some pretransitional light scattering close to the transition), and is homeotropic, optically uniaxial, and shows strong meridional x-ray diffraction peaks due to the smectic layers. Surface fields can also align this material, producing similar monodomains, but only with samples below a certain thickness. It seems that this thickness is independent of the cooling rate.

Alignment of a Smectic Side Chain Liquid Crystalline Polymer Using Surfaces and Alternating Electric Fields

Size effects in electrical conductivity

An expression for the temperature coefficient of resistance of metal films is derived wherein external and internal (grain boundary) size effects, thermal strain and difference in the thermal expansion coefficients between film and substrate are taken into account.

The size effect and the temperature coefficient of total resistance in thin metal films

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The size effect and the temperature coefficient of total resistance in thin metal films