F. Osawa
Daido University
3 Papers
17 Citations
F. Osawa is an academic researcher from Daido University. The author has contributed to research in topics: Thermal resistance & Thermal conductivity. The author has an hindex of 3, co-authored 3 publications.
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Papers
Reliability of Cu nanoparticle joint for high temperature power electronics
TL;DR: Power cycle reliability of Cu nanoparticle joint has been studied for high temperature operation of power devices and there were not many cracks formed after 3000 cycles but the maximum temperature during the power cycle test did not change at all because vertical cracks did not have an effect on preventing heat flow.
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Thermal simulation of joints with high thermal conductivities for power electronic devices
Toshitaka Ishizaki,M. Yanase,Akihiro Kuno,Toshikazu Satoh,Masanori Usui,F. Osawa,Yasushi Yamada +6 more
TL;DR: This study reveals that the design concept for power modules should change to preliminarily estimate the optimal thickness to achieve the minimum thermal resistance when the thermal conductivity of the joint layer is much higher than that of the heatsink.
17
Thermal characterizations of Cu nanoparticle joints for power semiconductor devices
TL;DR: The thermal resistance of the Cu nanoparticle joint was almost constant after the power cycling for 3000 cycles up to 200 °C even though that of the solder joint was rapidly increased.