There is provided a pellicle having a frame 12, a film 11 and an adhesive 13 for bonding the film 11 to the frame 12, and this adhesive 13 is a silicone compound having a low outgassing tendency and high heat resistance; in a better mode case, it can maintain its adhesive strength at temperatures 100 - 200 degrees C and it exhibits results of TML being 1.0 % or lower and CVCM being 0.1 % or lower when tested in accordance with ASTM E595-93; thus this pellicle is useful for EUV light exposure lithography.

A pellicle for lithography

Previous work has shown that photomask blank flatness as well as photomask patterning and pelliclization all play an
important role in finished photomask flatness. Additional studies have shown that pellicle mounting techniques,
pellicle adhesives, frame flatness and shape and pellicle mounting tools play a role as well. It has become clear that
frame flexibility, coupled with frame mounting surface flatness and shape are the principal factors influencing the
pellicle effect on the mask distortion. Pellicle suppliers have begun to evaluate various polymers as potential
replacements for the standard aluminum frame in current use. The elasticity of the frame adhesive has also been adjusted
to evaluate its effect on the pellicle influence on mask flatness.
This paper describes some joint evaluations between IBM, Toppan and ShinEtsu, performed to determine the effect of
pellicle frame composition,, mount surface flatness, adhesive elasticity and adhesive surface flatness on the distortion of
photolithography masks. It demonstrates that polymer pellicle frames with more flexible adhesive improve finished
mask flatness approximately the same amount as reducing the total frame standoff height of aluminum frames with
conventional adhesive.

Effect of pellicle frame and adhesive material on final photomask flatness

With the advancement of technology, the need to produce flatter photomasks is critical to
meet strict mask manufacturing requirements. Components such as pellicle mounting
techniques, pellicle frame height, frame material and adhesive all play an important role
in finished photomask flatness.1-5 In particular, recent studies have shown that adhesive
flexibility affect final photomask flatness significantly.6 This has motivated pellicle
suppliers to optimize adhesive properties in addition to evaluate new adhesives.
The paper describes the joint evaluations between IBM, Toppan and MLI, performed to
determine the effect of a new MLI adhesive on the distortion of photomasks. Due to the
nature of this adhesive, minimal mounting force is required. As a result of utilizing
extreme low mounting pressure, benefits such as decreased flatness distortion and ease of
adhesive removal are observed. The goal of this paper is to evaluate this new adhesive
offering and understand the various impacts it has on pelliclized photomasks for
advanced technologies.

Evaluation of easily removable pellicle adhesive

Photomask flatness and image placement specifications for advanced technology masks are becoming more
stringent. Therefore, it is important to understand the various factors that affect final photomask flatness due
to the direct impact it has on image placement. Past studies have demonstrated that final photomask flatness
can be controlled by modifying the mounting process of photomask pellicle as well as changing the pellicle
material itself [1][2][3][4]. In particular, our previous results demonstrate the ability to successfully eliminate
data deviations by remounting the same pellicle for each experiment. This paper focuses on the relationship
between mounting pressure and time on final photomask flatness. Our initial results indicate that mounting
time has minimal influence on final photomask flatness; however, final photomask flatness is greatly
impacted by varying mounting pressure. Finally we explore the relationship between the final photomask
flatness and the image placement for post pellicle mounting onto the photomask.

The relationship between mounting pressure and time on final photomask flatness

Analytical prediction of tensile stress of photomask protective membranes based on measured frequency spectrum

Advanced immersion lithography utilizes higher numerical aperture (NA) stepper lenses resulting in higher angles of light illumination through photomasks. Transmission in conventional pellicles (830 nm thickness) is generally maximized at 0 degree illumination and decreases significantly at the higher angles. Most pellicle suppliers have developed thinner pellicle membranes (~280 nm) which allow considerably improved transmission of light at angles up to 20 degrees. In addition, aluminum frames have been shortened, potentially allowing inspection closer to the inside of the frame and reduced mask flatness distortion upon pellicle mount. Suppliers have also developed advanced adhesives which reduce outgassing even beyond the low levels obtained with current 45 nm pellicles. In this paper, advanced immersion pellicles from several suppliers are evaluated and compared with conventional 45 nm pellicles for the following quality parameters: physical durability, foreign material, ease of demounting and glue removal, chemical outgassing, mask flatness distortion and susceptibility to radiation damage. Improvements in mask inspection and pellicle optical transmission at higher incident angles are also evaluated and are discussed. Keywords : Mask flatness, pellicle, adhesive, frame

Evaluation of 32nm advanced immersion lithography pellicles

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Evaluation of 32nm advanced immersion lithography pellicles