Eun-Sil Jung
6 Papers
44 Citations
Eun-Sil Jung is an academic researcher. The author has contributed to research in topics: Polyimide & Dielectric. The author has an hindex of 3, co-authored 6 publications.
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Papers
Fabrication of High-Density Wiring Interposer for 10 GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide
Katsuya Kikuchi,Shigemasa Segawa,Eun-Sil Jung,Yoshihiko Nemoto,Mitsuo Umemoto,Hiroshi Nakagawa,Kazuhiko Tokoro,Masahiro Aoyagi +7 more
TL;DR: In this paper, a high-density wiring interposer for 10 GHz 3D packaging using a photosensitive multiblock copolymerized polyimide was developed, which can realize micron-sized fine patterns without pattern shrinkage because of the nonrequirement of high-temperature thermal curing.
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New fabrication process for Josephson tunnel junctions using photosensitive polyimide insulation layer for superconducting integrated circuits
Katsuya Kikuchi,Shigemasa Segawa,Eun-Sil Jung,Hiroshi Nakagawa,Kazuhiko Tokoro,Hiroshi Itatani,Masahiro Aoyagi +6 more
TL;DR: In this article, the authors proposed a new fabrication process for the Josephson tunnel junction using a photosensitive polyimide, which is used as the insulation layer instead of conventional inorganic insulation films without an etching process.
9
Interlayer dielectric process for LSI circuits using positive photosensitive polyimide synthesized by block-copolymerization
Masahiro Aoyagi,Shigemasa Segawa,Eun-Sil Jung,Taro Itatani,Masanori Komuro,Tsuenenori Sakamoto,Hiroshi Itatani,Masataka Miyamura,Shunichi Matsumoto +8 more
- 24 Aug 2001
TL;DR: In this article, a positive photosensitive polyimide solution was prepared with N-methyl-2-pyrrolidone (NMP) solvent and a diazonaphthoquinone PC-5 was used as a photosensitizer.
8
Ultra wide bandwidth performance of high-density wiring interposer for 3D packaging
Katsuya Kikuchi,Shigemasa Segawa,Eun-Sil Jung,Yoshihiko Nemoto,Mitsuo Umemoto,Hiroshi Nakagawa,Kazuhiko Tokoro,Masahiro Aoyagi +7 more
- 01 Jun 2004
TL;DR: In this paper, a high-density wiring interposer for 10 GHz 3D packaging using a photosensitive multiblock copolymerized polyimide was demonstrated, which can realize micron-sized fine patterns without the pattern shrinkage because of not requiring high-temperature thermal curing.
3