In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies.

Engineered-phosphor led packages and related methods

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.

Led package, method for manufacturing led package, and packing member for led package

There is provided a lighting assembly comprising a plurality of lighting devices, each of which comprises a patterned diffuser having optical features. Each of the lighting devices is positioned such that if they are illuminated, at least 50, and in some cases 75 or more, percent of light emitted from each of the lighting devices will contact an illumination surface within an area of a defined shape (e.g., square, rectangular, hexagonal, octagonal, etc.), the respective shapes each sharing at least one boundary with another shape. Also, methods of lighting comprising illuminating lighting devices positioned in such a way.

Lighting assembly and lighting method

A LLB bulb includes a base, a LED light source configured to emit electromagnetic radiation, and a lens/cover having a light extracting rough surface pattern (LERSP) configured to reduce glare and reflection in the LLB bulb without light loss. A method for fabricating the LLB bulb includes the steps of providing the lens/cover, and forming the light extracting rough surface pattern (LERSP) on the lens/cover. The lens/cover can be fabricated with the light extracting rough surface pattern (LERSP) using a process such as bead blasting, sand blasting, etching (chemical or plasma), or molding.

Llb bulb having light extracting rough surface pattern (lersp) and method of fabrication

Encapsulated LEDs can be made by taking a mold tool defining a cavity that defines a lens shape and providing a patterned release film defining the inverse of a microstructure in a surface of the film The patterned release film is conformed to the cavity of the mold tool An LED chip is placed in a spaced relationship from the patterned release film in the cavity A resin is then introduced into the space between the LED chip and the patterned release film in the cavity The resin is cured in the space between the LED chip and the patterned release film in the cavity while contact is maintained between the patterned release film and the curing resin The encapsulated LED is then freed from the mold tool and the patterned release film

Method to Provide Microstructure for Encapsulated High-Brightness Led Chips

A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.

Textured encapsulant surface in led packages

Strukturierte Verkapselungsoberfläche bei LED-Gehäusen

Surface d'encapsulation texturée dans des boîtiers de DEL

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Textured encapsulant surface in led packages

Strukturierte Verkapselungsoberfläche bei LED-Gehäusen

Surface d'encapsulation texturée dans des boîtiers de DEL