A chip package includes: a substrate; a signal pad and a ground pad disposed on the substrate; a first and a second conducting layers disposed on the substrate and electrically connected to the signal pad and the ground pad, respectively, wherein the first and the second conducting layers extend from an upper surface of the substrate towards a lower surface of the substrate along a first and a second side surfaces of the substrate, respectively, and the first and the second conducting layers protrude from the lower surface; and a protection layer disposed on the substrate, wherein the protection layer completely covers the entire portion of the first conducting layer located on the first side surface of the substrate, and the entire portion of the second conducting layer located on the second side surface of the substrate is not covered by the protection layer.

Chip package and method for forming the same

A solar cell module includes: two solar cells, each including an photoelectric conversion body 10a, 10b having first and second main faces and generating photogenerated carriers, a first electrode provided on the first main face, and a second electrode provided on the first or second main face and having a polarity opposite to that of the first electrode; and a wiring member 2a for electrically connecting the first electrode of one of the two solar cells to the second electrode of the other solar cell. The first electrode has a plurality of finger electrodes for collecting the photogenerated carriers generated in the photoelectric conversion body 10a and a bus-bar electrode 11a for collecting the photogenerated carriers collected by the plurality of finger electrodes. The wiring member 2a is connected onto the bus-bar electrode 11a of the one solar cell through a connection layer 13 formed of a conductive resin containing conductive material. The connection layer 13 is also in contact with the first main face of the photoelectric conversion body 10a.

Solar cell module

This invention relates to compositions useful as adhesives and more particularly to the preparation of epoxy-based adhesive composition with improved impact resistance and good adhesion to oily metal substrates.

Curable epoxy resin-based adhesive compositions

The present invention provides an adhesive tape 10 for electrically connecting a plurality of solar battery cells, which adhesive tape has a metal foil 1 and an adhesive layer 2 composed of an adhesive provided on at least one surface of the metal foil 1, and a solar battery module using the adhesive tape The adhesive tape of the present invention can suppress the decrease in the product yield and can improve the connection workability of solar battery cells

Adhesive tape and solar cell module using the same

A high adhesive strength and good conduction reliability can be realized when anisotropic connection is performed under compression conditions of a compression temperature of 130° C and a compression time of 3 seconds using an anisotropic conductive film which uses a polymerizable acrylic compound capable of being cured at a comparatively lower temperature and in a comparatively shorter time than a thermosetting epoxy resin along with a film-forming resin Consequently, an anisotropic conductive film has a structure in which an insulating adhesive layer and an anisotropic conductive adhesive layer are laminated The insulating adhesive layer and the anisotropic conductive adhesive layer each contain a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator The polymerization initiator contains two kinds of organic peroxide having different one minute half-life temperatures Of the two kinds of organic peroxide, the organic peroxide having the higher one minute half-life temperature produces benzoic acid or a derivative thereof by decomposition

Anisotropic conductive film

The invention provides anisotropically conductive adhesive compositions, which comprise a mixture of a multifunctional glycidyl ether epoxy resin, a phenoxy resin, a core-shell polymer, optionally a thermoplastic resin, a thermally activated curing agent, and electrically conductive particles.

Anisotropic conductive adhesive compositions

A curable adhesive composition is disclosed comprising: at least one free radically polymerizable oligomer component; optionally at least one diluent monomer; at least one perfluorinated ether monomer; and a photoinitiator The curable liquid adhesive is easily removable with low force and low adhesive transfer

Low peel adhesive

Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.

Dicing tape and die attach adhesive with patterned backing

The invention provides anisotropically conductive adhesive compositions which comprise a mixture of: a cycloaliphatic epoxide resin; an omega hydroxyl ester-modified phenoxy resin; optionally, a multifunctional glycidyl ether epoxide resin; optionally, a thermoplastic resin; thermally activated catalyst; and electrically conductive particles.

Anisotropic conductive adhesive composition

A method of applying a curable composition. The method includes providing a curable composition comprising about 10 to about 60 weight percent of one or more epoxy resins; about 20 to about 80 weight percent of one or more resins selected from polyester resins, ethyl vinyl acetate resins, thermoplastic resins, and acrylate resins; up to about 30 weight percent of one or more hydroxyl-containing compounds; and an initiator selected from a photoinitiator, a thermal initiator, and combinations thereof. The method further includes initiating cure of the curable composition.

Nozzle sealing composition and method

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