Emmanuel Rolland
University of Grenoble
11 Papers
16 Citations
Emmanuel Rolland is an academic researcher from University of Grenoble. The author has contributed to research in topics: Scanning tunneling microscope & Fabrication. The author has an hindex of 4, co-authored 11 publications. Previous affiliations of Emmanuel Rolland include French Alternative Energies and Atomic Energy Commission.
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Papers
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO 2 direct hybrid bonding
Y. Beilliard,Stephane Moreau,L. Di Cioccio,Perceval Coudrain,G. Romano,A. Nowodzinski,F. Aussenac,Pierre-Henri Jouneau,Emmanuel Rolland,Thomas Signamarcheix +9 more
- 01 Dec 2014
TL;DR: A complete morphological, electrical and reliability study conducted on four-layer copper structures realized by Cu-SiO2 direct hybrid bonding, matching the interconnection needs in upcoming 3D circuits.
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CMOS Platform for Atomic-Scale Device Fabrication
Tomas Skeren,Nikola Pascher,Arnaud Garnier,Patrick Reynaud,Emmanuel Rolland,Aurélie Thuaire,Daniel Widmer,Xavier Jehl,Andreas Fuhrer +8 more
TL;DR: A device platform is demonstrated that overcomes limitations by integrating scanning-probe based dopant device fabrication with a CMOS-compatible process flow and opens the door to successful application of STM fabricated dopant devices in more complex device architectures.
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Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development
E. Bourjot,P. Stewart,C. Dubarry,E. Lagoutte,Emmanuel Rolland,N. Bresson,G. Romano,D. Scevola,V. Balan,Jerome Dechamp,M. Zussy,G. Mauguen,C. Castan,Loic Sanchez,A. Jouve,Frank Fournel,Severine Cheramy +16 more
- 01 Oct 2019
TL;DR: An overall integration scheme D2W HB process is proposed to reinforce its robustness and its economical relevance for microelectronics industry.
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WSS and ZoneBOND temporary bonding techniques comparison for 80μm and 55μm functional interposer creation
A. Jouve,K. Vial,Emmanuel Rolland,P. Coudrain,Christophe Aumont,C. Laviron,F. Fournel,M. Pellat,P. Montmeat,Nacima Allouti,Raphael Eleouet,Maxime Argoud,Jerome Dechamp,Laurent Bally,L. Vignoud,C. Donche,R. Hida,C. Ratin,Thomas Magis,V. Loup,R. Kachtouli,L. Gabette,Thierry Mourier,S. Cheramy,N. Sillon +24 more
- 28 May 2013
TL;DR: In this paper, the authors compared ZoneBOND and WSS (Wafer Support System) temporary bonding techniques for 3D interposer integration in 3D stacked ICs.
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Influence of Substrate Resistivity on Porous Silicon Small-Signal RF Properties
Geoffroy Godet,Emmanuel Augendre,Jose Lugo-Alvarez,Helene Jacquinot,F. Gaillard,Thomas Lorne,Emmanuel Rolland,T. Taris,Florence Servant +8 more
TL;DR: In this article, the authors provide guidelines to design porous silicon (PS) layers regarding optimization of small-signal properties in passive structures for radio frequency (RF): insertion loss and crosstalk.
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