Eiichi Ide
Hitachi
52 Papers
666 Citations
Eiichi Ide is an academic researcher from Hitachi. The author has contributed to research in topics: Anodic bonding & Silver oxide. The author has an hindex of 18, co-authored 52 publications. Previous affiliations of Eiichi Ide include Osaka University.
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Papers
Metal-metal bonding process using Ag metallo-organic nanoparticles
TL;DR: In this article, the average size of the Ag nanoparticles is around 11 nm, and each particle is covered with an organic shell, which has the outstanding feature that each nanoparticle exists independently and removal of the organic shell is necessary to bring out characteristics of the nanoparticle.
469
Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior
TL;DR: In this paper, the bonding mechanism of silver metallo-organic nanoparticles to bulk materials (gold and copper) is discussed based on the observations of the bonded interface using Transmission Electron Microscope (TEM).
140
Study of Bonding Technology Using Silver Nanoparticles
TL;DR: In this paper, a new bonding technique utilizing nano-scaled particles for use in high-temperature environments was investigated, and the results revealed that the method could be used to form bonds by simultaneously applying heat and pressure.
106
Joint strength and interfacial microstructure between Sn–Ag–Cu and Sn–Zn–Bi solders and Cu substrate
TL;DR: In this article, the effects of the addition of Ag, Bi and Pb to the solders, which are the ingredients of possible lead plating materials of quad plat package, solder layer thickness and aging treatments ranging from 358 to 423 K were investigated.
60
Patent
Conductive sintered layer forming composition and conductive coating film forming method and bonding method using the same
Eiichi Ide,Toshiaki Morita,Yusuke Yasuda,Hiroshi Hozoji +3 more
- 28 Dec 2007
TL;DR: In this paper, the authors provided a conductive sintered layer forming composition, which can lower heating temperature and shorten heating time for a process of accelerating sintering or bonding by using metal nano-particles coated with an organic substance.
58