The influence of carbon on the structure and photoluminescence of amorphous silicon carbonitride thin films

Silicon content influence on structure and photoluminescence properties of carbon rich hydrogenated amorphous silicon carbide thin films

Silicon carbonitride (SiCxNy) materials, inspired by their outstanding multifunctional properties, are finding increasing applications in a variety of fields, including as next generation solar cells and hard coatings. Hydrogenated SiCxNy thin films, along with binary submatrices of stoichiometric SiC and SiN3 as a reference, were deposited using electron cyclotron resonance plasma-enhanced chemical vapor deposition. We described a comparative study of the effects of post-deposition thermal annealing, from 300 to 1200 °C, on the evolution of hydrogen-rich a-SiC1.2N0.7:H1.4 thin films. Concurrently, two featured annealing temperatures (500 and 900 °C) were found to have the significant influence on the morphology, optical, and microstructural properties of the films. During annealing the amorphous phase of SiC1.2N0.7:H1.4 thin films was fully maintained according to the transmission electron microscopy and X-ray diffraction analyses. The hydrogen density was quantitatively analyzed employing two different experimental techniques, elastic recoil detection and Fourier transform infrared spectroscopy, showing the associate annealing temperatures of hydrogen desorption, breaking of all hydrogen-terminated bonds, and depletion of all hydrogen content. The refractive indices and optical band gap of the films were calculated using variable angle spectroscopic ellipsometer. Thermal annealing resulted in hydrogen desorption and consequently layer densification along with an increase in the refractive index. During the annealing process, first the optical band gap widened, and then narrowed due to hydrogen out-diffusion or chemical bond restructuring, depending on the annealing temperature. In addition, Rutherford backscattering spectrometry and X-ray photoelectron spectroscopy were performed. These findings are discussed in the context of the interdependency of the hydrogen desorption and thermally induced changes in chemical bonds, mass density, and optical properties.

Annealing of silicon carbonitride nanostructured thin films: interdependency of hydrogen content, optical, and structural properties

This work proposes a new method toward improving dielectric barrier characteristics through low dielectric permittivity (k) amorphous silicon nitride films (SiNx) deposited by plasma enhanced atomic layer deposition (PEALD). The dielectric constants of the atomic layer deposition (ALD) SiNx films were in the range of 4.25–4.71 and were relatively lower than that of SiNx deposited by plasma enhanced chemical vapor deposition (PECVD). The dielectric constants of the PEALD SiNx films were nearly identical to the values for PECVD silicon carbon nitride films (SiCN). Although the ALD SiNx films were low-k, they exhibited similar levels of film stress as PECVD SiNx, and the density of ALD SiNx film was higher than that of PECVD SiCN films. The ability to suppress copper (Cu) diffusion through 10-nm thick SiNx dielectric barriers in silicon dioxide/barrier/Cu/tantalum nitride structures on Si substrates was evaluated via Auger electron spectroscopy analysis. Although PEALD SiNx films possessed low dielectric con...

Dielectric barrier characteristics of Si-rich silicon nitride films deposited by plasma enhanced atomic layer deposition

Organosilicon compounds as single-source precursors for SiCN films production

Study of Cu diffusion behavior in carbon rich SiCN:H films deposited from trimethylphenylsilane

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Study of Cu diffusion behavior in carbon rich SiCN:H films deposited from trimethylphenylsilane