Molecular simulation of the plastic deformation and crack formation in single grit grinding of 4H-SiC single crystal

This article reviews advanced polishing, grinding and finishing processes for challenging manufacturing applications. The topics covered are machining of advanced alloys; machining of wafers; stren...

Advanced polishing, grinding and finishing processes for various manufacturing applications: a review

Molecular dynamics simulation of abrasive characteristics and interfaces in chemical mechanical polishing

Material removal and interactions between an abrasive and a SiC substrate: A molecular dynamics simulation study

Material removal and wear mechanism in abrasive polishing of SiO2/SiC using molecular dynamics

A new method of ultrasonic chemical mechanical polishing (CMP) combined with ultrasonic lapping is introduced to improve the machining performance of carbide silicon (SiC). To fulfill the method, an ultrasonic assisted machining apparatus is designed and manufactured. Comparative experiments with and without ultrasonic assisted vibration are conducted. According to the experimental results, the material removal rate (MRR) and surface generation are investigated. The results show that both ultrasonic lapping and ultrasonic CMP can decrease the two-body abrasion and reduce the peak-to-valley (PV) value of surface roughness, the effect of ultrasonic in lapping can contribute to the higher MRR and better surface quality for the following CMP. The ultrasonic assisted vibration in CMP can promote the chemical reaction, increase the MRR and improve the surface quality. The combined ultrasonic CMP with ultrasonic lapping achieved the highest MRR of 1.057 μm/h and lowest PV value of 0.474 μm. Therefore this sequent ultrasonic assisted processing method can be used to improve the material removal rate and surface roughness for the single crystal SiC wafer.

Investigation on the Material Removal and Surface Generation of a Single Crystal SiC Wafer by Ultrasonic Chemical Mechanical Polishing Combined with Ultrasonic Lapping

Experimental investigation on the ultrasonically assisted single-sided lapping of monocrystalline SiC substrate

Based on different damage forms of various contact forms to bone, the mechanical response and mechanism were investigated by nanoindentation under different sharpness contact forms. For the purpose of simulating the different sharpness contact forms, two kinds of indenters were used in experiments and finite elements simulations. Through nanoindentation experiments, it was concluded that the residual depth of sharp indenter was bigger than that of blunt indenter with small penetration depth. However, the contrary law was obtained with bigger penetration depth. There was a turning point of transition from blunt tendency to sharp tendency. By calculation, it was concluded that the sharper the indenter was, the bigger the proportion of plastic energy in total energy was. Basically, results of finite elements simulation could correspond with the experimental conclusions. By the observation of FE-SEM, the surface of cortical bone compressed was more seriously directly below the blunt indenter than the lateral face. For the berkovich indenter, the surface of indentation compressed was less directly below the indenter, but seriously on three lateral faces. This research may provide some new references to the studies of bone fracture mechanism in different load patterns in the initial press-in stage and offer new explanation for bone trauma diagnosis in clinical treatment and criminal investigation.

/pdf/influence-and-evolution-mechanism-of-different-sharpness-3b546g8v1v.pdf

Influence and evolution mechanism of different sharpness contact forms to mechanical property of cortical bone by nanoindentation

The phenomenon that water in bone has important influences on mechanical properties of cortical bone has been known. However, the detail of the influence mechanism is not clear, especially in the component hierarchy. The main objective of this paper is to investigate the mechanical properties of deproteinization bone and cortical bone with different water content by nanoindentation experiments. The deproteinization bone is cortical bone removed organic component, and demineralization bone is cortical bone removed inorganic component. The experiments results showed that the elastic modulus and hardness all increased with the decreasing of water content in both cortical bone and deproteinization bone. However, variations of deproteinization bone were more significant than the normal one. Without organic component, the shape and size of inorganic component (hydroxyapatite particles) turned to irregular. The plastic energy of both cortical bone and deproteinization bone all decreased with the decreasing of wa...

Influences of organic component on mechanical property of cortical bone with different water content by nanoindentation

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Papers

Investigation on the Material Removal and Surface Generation of a Single Crystal SiC Wafer by Ultrasonic Chemical Mechanical Polishing Combined with Ultrasonic Lapping

Experimental investigation on the ultrasonically assisted single-sided lapping of monocrystalline SiC substrate

Influence and evolution mechanism of different sharpness contact forms to mechanical property of cortical bone by nanoindentation

Influences of organic component on mechanical property of cortical bone with different water content by nanoindentation