The present invention provides a high-speed electrical interconnection system designed to overcome the drawbacks of conventional interconnection systems. That is, the present invention provides an electrical connector capable of handling high-speed signals effectively.

High-speed electrical connector

A method of providing a substantially void free layer for one or more flip chip assemblies, or one or more microelectronic components, utilizing a curable encapsulant. Also disclosed is a method of injecting an encapsulant into an assembly and a method of treating a microelectronic component to form a void free layer.

Methods for providing void-free layers for semiconductor assemblies

Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.

High density connector and method of manufacture

A method for manufacturing a plastic encapsulated semiconductor device is provided which comprises the steps of: clamping by upper and lower molds at least external leads and strips of a semiconductor device assembly formed using a lead frame which has a first connecting band connected to the external leads extending from one side of a substrate support further used as a heat sink, and a second connecting band connected to the strips having portions of small cross-sectional areas and of a predetermined length and extending from the other side of the substrate support, the cross sections being perpendicular to an extending direction of the strips, so that the substrate support may float in a cavity formed by the upper and lower molds and parts of the portions of small cross-sectional areas may be disposed in the cavity and the remaining parts thereof may be disposed between the upper and lower molds; injecting a plastic into the cavity; and cutting the portions of small cross-sectional areas of the strips which extend outside a plastic encapsulating housing along the end face of the plastic encapsulating housing and cutting a connecting portion between the external leads and the first connecting band. Also provided is a lead frame having the strips as decribed above. A plastic layer of desired thickness can be formed on the rear surface of the substrate support. Cutting of the strips from the plastic encapsulating housing is easy and reliable.

Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor

A connector for use with a circuit substrate having a plurality of elongated conductors. A solder ball is fused to the end of the conductors for connection of the connector to a circuit substrate. Method for attaching the solder ball to the end of the conductors using a solder paste with or without a preformed solder ball. The conductors are fitted into passages of an interface member. A tail end of each conductor terminates in a well in a surface of the interface member that facilitates the attachment of solder ball to the end of the conductors. The passages in the interface member hold the conductor tail ends in place while providing a clearance around the conductor to accommodate the effects of thermal expansion and contraction.

High density connector having a ball type of contact surface

Disclosed is a method of bonding electronic components (14) to metallized substrates (21) by soldering. The solder is first deposited on an unmetallized substrate (10) in a pattern of discrete pads (11, 12, 13) corresponding to the leads (28, 29, 30) of the components to be bonded. The component leads are then placed on the pads and the solder is reflowed. The solder thereby adheres to the leads so that a controlled amount of solder will remain on each lead when the component is lifted from the substrate. The components can then be soldered to an appropriate metallized substrate.

Method of bonding electronic components

Disclosed is a method of encapsulating integrated circuit chips formed on an insulating substrate which permits complete filling of areas under the chip. The encapsulant employed is a dispersion of a material, such as a silicone elastomer, which cures by reaction with water vapor. Subsequent to application of the encapsulant over and under the chip, the solvent of the dispersion is evaporated during a pre-cure treatment by means of a dry ambient of less than 5% relative humidity which suppresses crosslinking. After essentially all the solvent is thus removed, the encapsulant is cured by exposure to a second ambient of higher relative humidity which enhances crosslinking.

Encapsulation of integrated circuits

Magnetic alloy material

Bondverfahren fuer elektronische bauelemente

L'INVENTION CONCERNE LE SOUDAGE DES COMPOSANTS D'UN CIRCUIT ELECTRONIQUE. POUR SOUDER UN COMPOSANT 14 SUR UN SUBSTRAT METALLISE, ON DEPOSE TOUT D'ABORD DE LA SOUDURE SUR UN SUBSTRAT NON METALLISE EN FORMANT DES PLOTS DISCRETS 11, 12, 13 QUI CORRESPONDENT AUX CONDUCTEURS 28, 29, 30 DES COMPOSANTS A SOUDER. ON PLACE ENSUITE LES CONDUCTEURS DES COMPOSANTS SUR LES PLOTS ET ON FAIT REFONDRE LA SOUDURE ET ON ENLEVE LES COMPOSANTS DU SUBSTRAT NON METALLISE. LA SOUDURE QUI DEMEURE SUR CHAQUE CONDUCTEUR PERMET DE SOUDER ENSUITE LES COMPOSANTS SUR UN SUBSTRAT METALLISE APPROPRIE. APPLICATION A LA FABRICATION DES CIRCUITS HYBRIDES.

Procede de soudage d'un composant electronique

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