Sn-based lead-free solder alloys have been investigated widely to replace the traditional Sn–Pb solder alloys. Since the miniaturization of electronic products and the expansion of application field, the corrosion resistance of solder alloys play a key factor in the reliability of electronic products in long-term service. In this article, we review the recent progress on the corrosion behavior of Sn-based lead-free solder alloys by summarizing the results in representative ones of Sn–Bi, Sn–Cu, Sn–Zn, Sn–Ag, Sn–Ag–Cu and other multi-elements lead-free solder alloys. Specifically, the relationship between microstructure morphology and corrosion behavior, the corrosion mechanism of Sn-based lead-free solder alloys after incorporation of alloy elements or particles are summarized. It is hoped that this overview will provide some useful information in clarifying the corrosion mechanism and development of lead-free solder alloys. Furthermore, remaining difficulties and future trends in this research field are proposed.

Corrosion behavior of Sn-based lead-free solder alloys: a review

In the search for applications for alloys developed under the philosophy of the High Entropy Alloy (HEA)-type materials, the focus may be placed on applications where current alloys also use multiple components, albeit at lower levels than those found in HEAs. One such area, where alloys with complex compositions are already found, is in filler metals used for joining. In soldering ( 450 °C), filler metal alloys are taken above their liquidus temperature and used to form a metallic bond between two components, which remain both unmelted and largely unchanged throughout the process. These joining methods are widely used in applications from electronics to aerospace and energy, and filler metals are highly diverse, to allow compatibility with a broad range of base materials (including the capability to join ceramics to metals) and a large range of processing temperatures. Here, we review recent developments in filler metals relevant to High Entropy materials, and argue that such alloys merit further exploration to help overcome a number of current challenges that need to be solved for filler metal-based joining methods.

https://www.mdpi.com/1099-4300/23/1/78/pdf

High Entropy Alloys as Filler Metals for Joining.

Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder

The corrosion analysis of SAC305 lead free solder was investigated in Hydrochloric acid (HCl) solution. Potentiodynamic polarization was used to polarize the SAC305. The effect of polarization on the phase and microstructure were compared to as-prepared SAC305 solder. Potentiodynamic polarization introduces mixed corrosion products on the surface of SAC305 solder. The XRD analysis confirms that the mixed corrosion products emerged on the surface after polarization by formation of SnO and SnO2 of which confirmed that dissolution of Sn was dominant during polarization. Microstructure analysis reveal the presence of gap and porosities produced limits the protection offered by the passivation film.

Potentiodynamic polarization effect on phase and microstructure of SAC305 solder in hydrochloric acid solution

Corrosion Investigation of Sn-0.7Cu Pb-Free Solder in Open-Circuit and Polarized Conditions

The corrosion behavior of Sn–0.7Cu–xP (x = 0, 0.1, 0.3, 0.5) solder alloy in the aggressive environment was investigated by potentiodynamic polarization and weight loss method. Scanning electron microscope (SEM) was used to observe the morphology of Sn–0.7Cu–xP solder alloys and X-ray diffraction (XRD) was applied to characterize the phases formed on the surface after corrosion. The results indicate that phosphorus (P) can enhance the corrosion resistance of Sn–0.7Cu solder alloy whether in acidic or in alkaline solution, and its corrosion resistance increases with increasing P. The corrosion resistance of the solder alloy is better in alkaline solution compared to that in acidic solution. The morphology observation also shows that the incorporation of P into Sn–0.7Cu alloy can obviously decrease the damage extent of the solder alloys. XRD analysis reveals that the corrosion products both in acidic and alkaline solution are Sn oxides.

Effects of Phosphorus Addition on the Corrosion Resistance of Sn–0.7Cu Lead-Free Solder Alloy

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Effects of Phosphorus Addition on the Corrosion Resistance of Sn–0.7Cu Lead-Free Solder Alloy