In a lithographic process in which a series of wafers (W(i)) are processed in different contexts. Object data (ODAT/PDAT) is received which may be for example performance data (PDAT) representing overlay measured on a set of wafers that have been processed previously. Context data (CDAT) represents a parameters of the lithographic process that vary between wafers within the set. By principal component analysis or other statistical analysis of the performance data (410), the set of wafers into two or more subsets (412). The first partitioning of the wafers and the context data are used (414) to identify one or more relevant context parameters (418), being parameters of the lithographic process that are observed to correlate most strongly with the first partitioning. The lithographic apparatus is controlled (400) for new wafers by reference to the identified relevant context parameters. Embodiments with feedback control and feedforward control are described.

Methods & apparatus for controlling an industrial process

An information processing system, having one or more information processing apparatuses, includes a data input unit configured to take as input first data being multidimensional; a dimension reduction unit configured to generate, based on the first data, second data representing a characteristic of the first data, the second data having a prescribed number of dimensions fewer than a number of dimensions of the first data; and a distinguishing unit configured to distinguish whether the first data is normal data or abnormal data by a semi-supervised anomaly detection, based on the first data and the second data.

Information processing system, information processing apparatus, and information processing method

Measurements are obtained from locations across a substrate (W') before or after performing a lithographic process step. Examples of such measurements include alignment measurements made prior to applying a pattern to the substrate, and measurements of performance parameters such as overlay, after a pattern has been applied. A set of measurement locations (606, 606' or 606") is selected from among all possible measurement locations (302). At least a subset of the selected measurement locations are selected dynamically (202c), in response to measurements obtained using a preliminary selection (610) of measurement locations. Preliminary measurements of height can be used to select measurement locations for alignment. In another aspect of the disclosure, outlier measurements are detected based on supplementary data such as height measurements or historic data.

Method of obtaining measurements, apparatus for performing a process step and metrology apparatus

A method of determining a correction for a process parameter related to a lithographic process, wherein the lithographic process includes a plurality of runs during each one of which a pattern is applied to one or more substrates. The method of determining includes obtaining pre-exposure metrology data describing a property of a substrate; obtaining post-exposure metrology data comprising one or more measurements of the process parameter having been performed on one or more previously exposed substrates; assigning, based on the pre-exposure metrology data, a group membership status from one or more groups to the substrate; and determining the correction for the process parameter based on the group membership status and the post-exposure metrology data.

Methods of determining corrections for a patterning process

A system for monitoring one or more conditions of an automation system of a semiconductor factory includes one or more instrumented substrates, one or more sealable containers and one or more system servers. The one or more instrumented substrates include one or more sensors. The one or more sensors measure one or more conditions of the one or more instrumented substrates as the one or more sealable containers transport the one or more instrumented substrates through the semiconductor factory. The one or more sealable containers also receive sensor data from the one or more sensors included on the one or more instrumented substrates. The one or more system servers are configured to receive the sensor data from the one or more sealable containers. The one or more servers are configured to identify one or more deviations in the measured one or more conditions.

System and method for monitoring parameters of a semiconductor factory automation system

In a lithographic process product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each wafer. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose the set of said vectors representing the wafers in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using said component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

Methods & apparatus for obtaining diagnostic information relating to an industrial process.

In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

Methods and apparatus for obtaining diagnostic information relating to an industrial process

In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors Diagnostic information about the industrial process is extracted using the component vectors The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information

Methods, apparatus and computer program product for obtaining diagnostic information relating to an industrial process

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Methods & apparatus for obtaining diagnostic information relating to an industrial process.

Methods and apparatus for obtaining diagnostic information relating to an industrial process

Methods, apparatus and computer program product for obtaining diagnostic information relating to an industrial process