An optical verification method and mass transfer system described. In an embodiments, a mass transfer sequence may be accompanied by optical imaging and inspection to detect pick and place errors. The optical imaging and inspection techniques may be performed in-situ.

Optical verification system and methods of verifying micro device transfer

A display device includes a cover unit and a display panel coupled to the cover unit. The cover unit includes a first base member disposed on the display panel and including a first area and a second area when viewed in a plan view, a pattern layer disposed between the first base member and the display panel, a color layer disposed between the first base member and the pattern layer and having a light transmittance, and a reflective layer disposed between the display panel and the pattern layer.

Cover unit and display device having the same

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.

Guided transport path correction

Inkjet printing system for processing substrates including a chuck for placement of a substrate and an inkjet printing head with at least one nozzle. Each chuck has chuck reference marks, each of which is associated with an associated camera. An electronic controller assembly is configured to take a set of images each instance a substrate having substrate reference marks has been placed on a chuck, with each image containing a chuck reference mark and a substrate reference mark. For each image, the position of the chuck relative to the camera and the position of the substrate relative to the camera is determined. Subsequently, the substrate position relative to the chuck is calculated and based thereon the firing of the at least one nozzle is timed and the movement of the printing motion assembly is controlled so that the liquid drops are accurately positioned on the substrate.

Inkjet printing system and method for processing substrates

An inkjet printer is described. The inkjet printer has a substrate holder assembly that includes a base member having a long axis in a first direction and a short axis in a second direction perpendicular to the first direction; a contact member coupled to the base member, the contact member having a long axis in the first direction and a short axis in the second direction; a holder carriage coupled to the base member; a linear extender coupled between the base member and the contact member and extending in a third direction intersecting with the first direction and the second direction from the base member toward the contact member; and a flex member coupled to the base member, extending in the second direction between the linear extender and the contact member, and having a flex direction in a direction perpendicular to the first direction and the second direction.

Inkjet printer with substrate height position control

This disclosure provides a high precision measurement system for rapid, accurate determination of height of a deposition source relative to a deposition target substrate. In one embodiment, each of two transport paths of an industrial printer mounts a camera and a high precision sensor. The cameras are used to achieve registration between split transport axes, and the positions of the high precision sensors are each precisely determined in terms of xy position. One of the high precision sensors is used to measure height of the deposition source, while another measures height of the target substrate. Relative z axis position between these sensors is identified to provide for precise z-coordinate identification of both source and target substrate. Disclosed embodiments permit dynamic, real-time, high precision height measurement to micron or submicron accuracy.

Precision position alignment, calibration and measurement in printing and manufacturing systems

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product. At least one mechanical component experiences mechanical error, which is mitigated using transducers that equalize position of a transported thing, e.g., to provide an “ideal” conveyance path; a substrate conveyance system and/or a printhead conveyance system can each use transducers in this manner to improve precise droplet placement. In one embodiment, errors are measured in advance, with corrections being “played back” during production runs to mitigate repeatable transport path error. In a still more detailed embodiment, the transducers can be predicated on voice coils, which cooperate with a floatation table and floating, mechanical pivot assembly to provide frictionless, but mechanically-supported error correction.

Transport path correction techniques and related systems, methods and devices

인쇄기는, 전자 제품을 위한 제조 프로세스의 일부로서, 기판 상에 물질을 증착한다. 적어도 하나의 기계적 구성요소는 기계적 오차를 경험하는데, 이는, 가령, "이상적인" 운송 경오를 제공하기 위해, 이송된 것의 위치를 균등화하는 트랜스듀서를 사용하여, 완화되고, 기판 운송 시스템 및/또는 인쇄헤드 운송 시스템은 정확한 액적 위치배정을 개선하기 위해 이러한 방식으로 트랜스듀서를 각각 사용할 수 있다. 일 실시예에서, 오차는 미리 측정되고, 교정은 반복가능한 이송 경로 오차를 완화시키기 위해 생산 실행 동안에, "플레이 백"된다. 여전히 좀 더 상세한 실시예에서, 트랜스듀서는 보이스 코일에 입각될 수 있는데, 이는 플로테이션 테이블과 플로팅, 기계적 피봇 어셈블리와 협력하여, 마찰이 없지만, 기계적으로-지지되는 오차 교정을 제공한다.

이송 경로 교정 테크닉 및 관련 시스템, 방법과 디바이스

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Precision position alignment, calibration and measurement in printing and manufacturing systems

Transport path correction techniques and related systems, methods and devices

이송 경로 교정 테크닉 및 관련 시스템, 방법과 디바이스