PROBLEM TO BE SOLVED: To solve the problem, wherein it is impossible for an electronic content information provider to provide commercially secure and effective method, for a configurable general-purpose electronic commercial transaction/distribution control system. SOLUTION: In this system, having at least one protected processing environment for safely controlling at least one portion of decoding of digital information, a secure content distribution method comprises a process for encapsulating digital information in one or more digital containers; a process for encrypting at least a portion of digital information; a process for associating at least partially secure control information for managing interactions with encrypted digital information and/or digital container; a process for delivering one or more digital containers to a digital information user; and a process for using a protected processing environment, for safely controlling at least a portion of the decoding of the digital information. COPYRIGHT: (C)2006,JPO&NCIPI

https://apps.dtic.mil/dtic/tr/fulltext/u2/a423264.pdf

Systems and Methods for Secure Transaction Management and Electronic Rights Protection

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

Documents and other items can be delivered electronically from sender to recipient with a level of trustedness approaching or exceeding that provided by a personal document courier. A trusted electronic go-between can validate, witness and/or archive transactions while, in some cases, actively participating in or directing the transaction. Printed or imaged documents can be marked using handwritten signature images, seal images, electronic fingerprinting, watermarking, and/or steganography. Electronic commercial transactions and transmissions take place in a reliable, “trusted” virtual distribution environment that provides significant efficiency and cost savings benefits to users in addition to providing an extremely high degree of confidence and trustedness. The systems and techniques have many uses including but not limited to secure document delivery, execution of legal documents, and electronic data interchange (EDI).

Trusted and secure techniques, systems and methods for item delivery and execution

An integrated, modular array of administrative and support services are provided for electronic commerce and electronic rights and transaction management. These administrative and support services supply a secure foundation for conducting transaction-related capabilities over electronic networks, and can also be adapted to the specific needs of electronic commerce value chains. In one embodiment a Distributed Commerce Utility having a secure, programmable, distributed architecture provides these administrative and support services. The Distributed Commerce Utility may comprise a number of Commerce Utility Systems. These Commerce Utility Systems provide a web of infrastructure support available to, and reusable by, the entire electronic community and/or many of its participants. Different support functions can be collected together in hierarchical and/or networked relationships to suit various business models or other objectives. Modular support functions can be combined in different arrays to form different Commerce Utility Systems for different design implementations and purposes.

Trusted infrastructure support systems, methods and techniques for secure electronic commerce, electronic transactions and rights management

Secure computation environments are protected from bogus or rogue load modules, executables and other data elements through use of digital signatures, seals and certificates issued by a verifying authority. A verifying authority—which may be a trusted independent third party—tests the load modules or other executables to verify that their corresponding specifications are accurate and complete, and then digitally signs the load module or other executable based on tamper resistance work factor classification. Secure computation environments with different tamper resistance work factors use different verification digital signature authentication techniques (e.g., different signature algorithms and/or signature verification keys)—allowing one tamper resistance work factor environment to protect itself against load modules from another, different tamper resistance work factor environment. Several dissimilar digital signature algorithms may be used to reduce vulnerability from algorithm compromise, and subsets of multiple digital signatures may be used to reduce the scope of any specific compromise.

Systems and Methods Using Cryptography to Protect Secure Computing Environments

An interconnect structure capable of reducing intralevel capacitance in a damascene metalization process employs entrapped air gaps between metal lines. The structure comprises at least first and second metal regions separated by a dielectric region, an air gap formed at least partially within the dielectric region, a diffusion barrier positioned over the two metal regions covering a portion of the upper surface of the air gap, and an insulating layer positioned over the diffusion barrier sealing the upper surface of the air gap.

Semiconductor interconnect structure with air gap for reducing intralayer capacitance in metal layers in damascene metalization process

A collimator system for use in PVD sputtering of semiconductor wafers having multiple tiers provided between a target and wafer substrate. The collimator system prevents target atoms from contacting the wafer at substantially oblique angles, thereby providing good step coverage uniformity over the surface of the wafer. Additionally, the presence of more than one tier prevents localized build-up of target atoms that occurs in conventional single tier collimators, thereby providing good flat coverage uniformity over the surface of the wafer.

Multiple tier collimator system for enhanced step coverage and uniformity

A method of reducing intralevel capacitance in a damascene metalization process employs entrapped air gaps between metal lines. The method involves forming a metalization pattern using a damascene process which includes forming at least first and second metal regions separated by a dielectric region, forming an air gap at least partially within the dielectric region, and sealing the air gap to entrap the air gap between the first and second metal regions thereby reducing intralevel capacitance between the first and second metal regions.

Method of producing air gap for reducing intralayer capacitance in metal layers in damascene metalization process and product resulting therefrom

An integrated circuit and a method of forming an integrated circuit is described. The integrated circuit includes a silicon substrate, a dielectric stack formed on the silicon substrate, and conductive metal lines overlying the silicon substrate. A first layer of low-k dielectric material overlies the at least one conductive metal line, and a second layer of low-k dielectric material overlies the first layer of low-k dielectric material. The first layer of low-k dielectric material is electron beam (E-beam) cured and the second layer of low-k dielectric material is thermally cured.

Electron bean curing of low-k dielectrics in integrated circuits

A PVD sputter system having a nonplanar target surface is disclosed. The configuration of the nonplanar target surface is adjusted to provide improved uniformity in deposition film thickness and step coverage at the peripheral boundary regions of the substrate. Emission-inducing power is distributed independently to different portions of the nonplanar target surface so as to modify the deposition profile according to substrate size and other factors.

PVD sputter system having nonplanar target configuration and methods for constructing same

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