Daniela Cavallaro
STMicroelectronics
17 Papers
40 Citations
Daniela Cavallaro is an academic researcher from STMicroelectronics. The author has contributed to research in topics: Power semiconductor device & Power module. The author has an hindex of 6, co-authored 16 publications.
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Papers
Thermal Analysis Approach for Predicting Power Device Lifetime
TL;DR: In this paper, the authors predict the device lifetime under a power cycling test by a simulation method that is based on a distributed self-heating SPICE model and a correlation between numeric extrapolation and experimental data is done by considering the Repetitive Avalanche test, which evaluates the ruggedness of a power device.
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Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations
TL;DR: Electro-thermal-mechanical simulation by Finite Element Model (FEM) has been employed in fatigue analysis of a MOSFET structure under electro-Thermal stress and it has been observed that thermal cycling to the point of maximum stress in the solder layer occurs at the edge of the die.
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A New Analog Behavioral SPICE Macro Model with Thermal and Self-Heating effects for Silicon Carbide Power MOSFETs
Gaetano Bazzano,Daniela Cavallaro,Rosario Greco,Alessandra Raffa,Pier Paolo Veneziano +4 more
- 19 May 2015
TL;DR: In this article, self-heating effects in Silicon Carbide Power MOSFETs have been incorporated into a behavioural SPICE model, which allows a good prediction of DC and AC variation due to temperature in the range of the component.
14
Solder Joint Reliability: Thermo-mechanical analysis on Power Flat Packages
Alessandro Sitta,Alessandro Sitta,Michele Calabretta,Marco Renna,Daniela Cavallaro +4 more
- 01 Jan 2017
TL;DR: An overview of the new methodological approach leaded by Finite Element (FE) simulation for new packages and interconnection solution ideas for Power Electronic performance depends by a high ratio on package technologies and on their interconnections.
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Numerical approach to predict power device reliability
Alessandro Sitta,Sebastiano Russo,Gaetano Bazzano,Daniela Cavallaro,Giuseppe Greco,Michele Calabretta +5 more
- 09 Apr 2018
TL;DR: A predictive method to estimate the power device reliability under active cycle tests is able to predict, through a numerical model, the local maximum temperature during test, by correlating the numerical thermal maps results with the experimental temperature distribution obtained from an infra-red camera.
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