Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

Single-phase and Two-phase Flow and Heat Transfer in Microchannel Heat Sink with Various Manifold Arrangements

Enhanced flow boiling in silicon nanowire-coated manifold microchannels

Study on the effect of varying channel aspect ratio on heat transfer performance of manifold microchannel heat sink

/pdf/embedded-two-phase-cooling-of-high-flux-electronics-via-3pnrc9cc5b.pdf

Embedded Two-Phase Cooling of High Flux Electronics via Press-Fit and Bonded FEEDS Coolers

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

Two-phase microchannel cooling has demonstrated substantial performance enhancement for thermal management of high-power electronics, offering remarkable heat removal capability without imposing high pumping power penalties. However, similar to other bulk cooling methods, this method alone too has difficulty in addressing remediation of local hotspots. Thermoelectric coolers, on the other hand, are scalable and perfectly suited for localized cooling. Thus in this paper, we report our work on integration of a micro-contact enhanced TEC with FEEDS (thin-Film Evaporation and Enhanced fluid Delivery System) manifold-micro channel system. Combining these two thermal management schemes into a single system can provide effective heat removal over the entire electronic chip surface. Integration of these two methods, however, poses several challenges, including hermetic sealing, wiring of the TEC, excessive joule heating in electrical traces, and thermal/electrical short-circuits. Thus, the aim of this study was to integrate an optimized, 3 mm × 0.8 mm TEC into a FEEDS manifold-microchannel system to create a reliable high flux cooling mechanism on a silicon or silicon carbide chip for cooling of 5kW/cm2 hotspot and 1kW/cm2 background heat fluxes. The manufacturing, integration configuration, and assembly of the system are discussed in this paper. A numerical model of the system is built and simulated using the commercial finite-element analysis software ANSYS. Preliminary numerical results demonstrated that with 30 °C temperature rise at the SiC chip's background surface, less than 35 °C hotspot temperature rise with respect to the coolant fluid temperature (110 °C) can be achieved.

Integration of micro-contact enhanced thermoelectric cooler with a FEEDS manifold-microchannel system for cooling of high flux electronics

NASA’s Dragonfly mission is a rotorcraft lander which will explore several geologic locations on Saturn’s moon, Titan and investigate evidence of surface-level prebiotic chemistry as well as search for chemical signatures of water-based and/or hydrocarbon-based life. To perform molecular composition investigations in-situ, the payload includes the Dragonfly Mass Spectrometer (DraMS), being developed at NASA’s Goddard Space Flight Center (GSFC). DraMS will utilize laser desorption mass spectrometry (LDMS) to interrogate surface samples and measure the organic composition. Enabling this science capability is the Throttled Hydrocarbon Analysis by Nanosecond Optical Source (THANOS) laser being developed at NASA-GSFC. The THANOS laser is comprised of a solid state, passively Q-Switched Nd:YAG oscillator which is frequency converted to 266 nm and utilizes a RTP high voltage electro-optic for pulse energy control. The laser outputs <2.0 ns pulses with a maximum energy of approximately 200 uJ which can be emitted in 1 - 50 shot bursts at 100 Hz while performing LDMS science operations. The laser has the capability to throttle its UV pulse energy output from full attenuation to maximum energy to provide varying levels of fluence on samples in the DraMS instrument. We report on the THANOS’ laser technology development and space qualification effort including vibration, thermal vacuum cycling, radiation as well as optical damage testing due to Titan’s atmospheric composition, performed at NASA-GSFC from 2019 through 2022.

Technology development of a solid state 266 nm laser for NASA’s Dragonfly mission

Today’s compact electronic packages consist of chips with different restrictions on their operating temperatures. To ensure reliability in such devices, each component must be kept within their temperature limits. This often results in overcooling the entire package to meet the lowest temperature limit that exists within the system, leading to an inefficient thermal management scheme. By implementing localized cooling, the chips with lower operating temperatures can be thermally de-coupled from the rest of the package, providing a more energy efficient solution. Thermoelectric coolers are favorable candidates for such localized cooling, due to their compact form-factor and solid-state nature. Thus, in this paper, the utilization of a thermoelectric cooler to thermally de-couple an optical array—with a temperature limitation of 85°C—from a larger electronic device—with a temperature limitation of 105°C—is investigated. The system is initially modeled in the commercially available FEM software ANSYS for illustrating the theoretical enhancement of using a thermoelectric cooler. Finally, a test setup of the actual stack-up is built and the thermal de-coupling is experimentally demonstrated using a commercially available thermoelectric cooler.

Packaging and Thermal Decoupling of an Optical Array using a Thermoelectric Cooler

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