Material challenge for flexible organic devices

Durability of nanosized oxygen-barrier coatings on polymers

Flexible electronics incorporate all the functional attributes of conventional rigid electronics in formats that have been altered to survive mechanical deformations. Understanding the evolution of device performance during bending, stretching, or other mechanical cycling is, therefore, fundamental to research efforts in this area. Here, we review the various classes of flexible electronic devices (including power sources, sensors, circuits and individual components) and describe the basic principles of device mechanics. We then review techniques to characterize the deformation tolerance and durability of these flexible devices, and we catalogue and geometric designs that are intended to optimize electronic systems for maximum flexibility.

Flexible electronics under strain: a review of mechanical characterization and durability enhancement strategies

Analyzing a shear-lag model, the evolution of the fragment size distribution in the sequential cracking of polymer coatings under uniaxial loading is investigated. This study elucidates the role of a nonlinear elastic stress transfer mechanism at the interface on the fragmentation kinetics. Using a nonlinear expression for the shear stress at the interface, analytical expressions for the stress and the strain in the coating are derived. In the initial stage of cracking, the strain in a fragment equals the substrate's strain everywhere except in the exclusion zone at the fragments' edges. In the later stages of fragmentation, the stress and the strain in a fragment attain a universal scaling form with pronounced maxima in the centers of the fragments. Assuming a three parameter Weibull distribution for the statistical distribution of the coating's strength, analytical expressions for the fragment size distribution in the initial stage and numerical results for the fragment size distribution in the later stages of the cracking process are derived.

Analysis of a shear-lag model with nonlinear elastic stress transfer for sequential cracking of polymer coatings

Evaluation of toughness by finite fracture mechanics from crack onset strain of brittle coatings on polymers

Crack patterns of 53 nm and 103 nm thick silicon oxide coatings on poly(ethylene terephthalate) films are analyzed under equibiaxial stress loading, by means of a bulging cell mounted under an optical microscope with stepwise pressurization of film specimens. The biaxial stress and strain are modeled from classical elastic membrane equations, and an excellent agreement is obtained with a finite element method. In the large pressure range, the derivation of the biaxial strain from force equilibrium considerations are found to reproduce accurately the measured data up to 25% strain. The examination of the fragmentation process of the coating under increasing pressure levels reveals that the crack onset strain of the oxide coating is similar to that measured under uniaxial tension. The fragmentation of the coating under biaxial tension is also characterized by complex dynamic phenomena which image the peculiarities of the stress field, resulting in considerable broadening of the fragment size distribution. The evolution of the average fragment area as a function of biaxial stress in the early stages of the fragmentation process is analyzed using Weibull statistics to describe the coating strength.

/pdf/biaxial-fragmentation-of-thin-silicon-oxide-coatings-on-poly-57p7u937xb.pdf

Biaxial fragmentation of thin silicon oxide coatings on poly(ethylene terephthalate)

Failure mechanics of thin coatings under multiaxial loading

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Biaxial fragmentation of thin silicon oxide coatings on poly(ethylene terephthalate)

Failure mechanics of thin coatings under multiaxial loading