Due to the unprecedented growth in wireless applications over the past decade, development of low-cost solutions for RF and microwave communication systems has become of great importance. This practical new book is the first comprehensive treatment of lumped elements, which are playing a critical role in the development of the circuits that make these cost-effective systems possible. The books offers you an in-depth understanding of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers. Supported with over 220 equations and more than 200 illustrations, it covers the practical aspects of each element in exceptional detail. No other single volume treats this subject matter in such depth. From materials, fabrication, and analyses - to design, modeling, and physical, electrical, and thermal applications, this unique resource offers you complete coverage of the critical topics you need understand for your work in the field. Offering the most comprehensive, up-to-date body of knowledge on lumped elements, the book is an indispensable professional reference and serves as an excellent text for senior undergraduate and graduate-level courses in RF and microwave circuit design.

Lumped Elements for RF and Microwave Circuits

Preface. Microelectromechanical Systems (MEMS) and Radio Frequency MEMS. MEMS Materials and Fabrication Techniques. RF MEMS Switches and Micro Relays. MEMS Inductors and Capacitors. Micromachined RF Filters. Micromachined Phase Shifters. Micromachined Transmission Lines and Components. Micromachined Antennae. Integration and Packaging for RF MEMS Devices. Index.

RF MEMS and their applications

List of Figures. List of Tables. Preface. Acknowledgments. Part I: Analysis and Simulation of Passive Devices. 1. Introduction. 2. Problem Description. 3. Previous Work. 4. Electromagnetic Formulation. 5. Inductance Calculations. 6. Calculation of Eddy Current Losses. 7. Asitic. 8. Experimental Study. Part II: Applications of Passive Devices. 9. Voltage Controlled Oscillators. 10. Distributed Amplifiers. 11. Conclusion. Appendices.

Design, Simulation and Applications of Inductors and Transformers for Si RF ICs

This paper discusses the modelling, design and characterization of planar microcoils to be used in telemetry systems that supply energy to miniaturized implants. Parasitic electrical effects that may become important at a.c. frequencies of several megahertz are evaluated. The fabrication process and electrical characterization of planar receiver microcoils will be described, and it will be shown that a power of a few milliwatts is feasible.

Characterization of a planar microcoil for implantable microsystems

The wireless communication revolution has spawned a revival of interest in the design and optimization of radio transceivers. Passive elements such as inductors, capacitors, and transformers have the potential to improve the performance of key RF building blocks. Their use, though, not only necessitates proper modeling of electrostatic and magnetostatic effects, but also electromagnetic parasitic substrate coupling. 
This work focuses on the analysis and application of such passive devices. From Maxwell's equations, an accurate and efficient technique is developed to model the device over a wide frequency range. In particular, we demonstrate techniques for calculating the loss when such devices are fabricated in the vicinity of conductive substrates such as silicon. Energy couples to a conductive substrate through several mechanisms, such as through electrically induced displacement and conductive currents, and by magnetically induced eddy currents. Green functions for Poisson's equation and the eddy current partial differential equations are derived and employed to account for the various loss mechanisms. Numerical techniques are developed to efficiently and accurately compute the underlying Green functions. These techniques have been compiled in a user-friendly software tool, ASITIC, “Analysis and Simulation of Inductors and Transformers for Integrated Circuits”. This tool allows circuit and process engineers to design and optimize the geometry of passive devices and the process parameters to meet electrical specifications. 
Two key RF building block applications, a 4.4 GHz voltage controlled oscillator (VCO) and a distributed amplifier, are presented. In the VCO, the center-tapped monolithic inductor is at the heart of the resonant tank, a key component in determining the phase noise and power dissipation in the VCO. In the distributed amplifier, lumped inductors and capacitors, or on-chip transmission lines, allow broadband operation. The losses in the passive devices determine the achievable gain and power dissipation. Optimization of such passive devices is thus integral in the design of such building blocks.

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Analysis, simulation, and applications of passive devices on conductive substrates

Spiral microstrip inductors with up to two full turns have been modeled by using parallel coupled and single transmission lines. With this method, the electrical characteristics of these inductors, which may be fabricated as elements of MIC and MMIC circuits, can be designed for reactance up to 200 ohms with a maximum error of 15 percent for frequencies up to the K/sub u/ band.

A New Transmission Line Approach for Designing Spiral Microstrip Inductors for Microwave Integrated Circuits

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A New Transmission Line Approach for Designing Spiral Microstrip Inductors for Microwave Integrated Circuits