22 Papers
10 Citations
Chen Li is an academic researcher from Harbin Institute of Technology. The author has contributed to research in topics: Grinding & Machining. The author has an hindex of 9, co-authored 22 publications.
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Papers
Material removal mechanism and grinding force modelling of ultrasonic vibration assisted grinding for SiC ceramics
TL;DR: In this paper, a varied-depth nano-scratch test of single grain is carried out on a nano indentation system and a theoretical model of the normal grinding force is acquired using the material removal in unit time as a bridge.
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Phase transition and plastic deformation mechanisms induced by self-rotating grinding of GaN single crystals
TL;DR: In this paper, the deformation and removal mechanisms of gallium nitride (GaN) single crystals involved in the ultra-precision machining process are not well revealed and few investigations on the grinding of GaN crystals have been reported.
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Repeated nanoscratch and double nanoscratch tests of Lu2O3 transparent ceramics: Material removal and deformation mechanism, and theoretical model of penetration depth
TL;DR: In this article, a model of the penetration depth in single scratch, repeated nanoscratch and double nano-cratch tests of Lu 2 O 3 transparent ceramics is established by taking the elastic recovery into account.
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Anisotropy dependence of material removal and deformation mechanisms during nanoscratch of gallium nitride single crystals on (0001) plane
TL;DR: In this paper, the anisotropy dependence of material removal and deformation behaviors was investigated systematically, and the results showed that crack-free plastic deformation of GaN crystals could be acquired along different zone axes, which was dominated by phase transition, polycrystalline nanocrystals, amorphous transition, as well as close-to-atomic scale damages including stacking faults, dislocations and lattice distortions.
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Research of material removal and deformation mechanism for single crystal GGG (Gd3Ga5O12) based on varied-depth nanoscratch testing
TL;DR: In this paper, two indenters with different tip radii are used to obtain continuous chips and the bottom of the groove with micro cracks and slip lines during the nanoscratch process.
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