Damascene copper electroplating for on-chip interconnections, a process that we conceived and developed in the early 1990s, makes it possible to fill submicron trenches and vias with copper without creating a void or a seam and has thus proven superior to other technologies of copper deposition. We discuss here the relationship of additives in the plating bath to superfilling, the phenomenon that results in superconformal coverage, and we present a numerical model which accounts for the experimentally observed profile evolution of the plated metal.

Damascene copper electroplating for chip interconnections

Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole

A series of DPP derivatives bearing quaternary ammonium salt centers with different lengths of carbon chains have been designed and synthesized. Their inhibition actions on copper electroplating were first investigated. A total of four diketopyrrolopyrrole (DPP) derivatives showed different inhibition capabilities on copper electroplating. To investigate interactions between metal surface and additives, we used quantum chemical calculations. Static and dynamic surface tension of four DPP derivatives had been measured, and the results showed DPP-10C (1c) with a faster-decreasing rate of dynamic surface tension among the four derivatives, which indicated higher adsorption rate of additive on the cathode surface and gives rise to stronger inhibiting effect of copper electrodeposition. Then, DPP-10C (1c) as the representative additive, was selected for the systematic study of the leveling influence during microvia filling through comprehensive electroplating tests. In addition, field-emission scanning electro...

Synthesis of Quaternary Ammonium Salts Based on Diketopyrrolopyrroles Skeletons and Their Applications in Copper Electroplating

The effect of tricyclazole as a novel leveler for filling electroplated copper microvias

Metamaterials typically consist of metallic and dielectric repeating structures. Electrodeposition of copper is the preferred approach to fabricating the metallic part of the metamaterials of interest in this study. The highly-variant topography requires chemical additives, like chloride ions, 3-mercapto-1-propanesulfonic acid (MPSA), polyethylene glycol (PEG) and polyvinylpyrrolidone (PVP) to enhance bottom-up superfilling while maintaining terrace flatness. This study focuses on both experimental and computational investigations of the degradation potential of the additives and their adsorption mechanism in a highly-acidic copper electrolyte in order to optimally parameterize the copper electrodeposition process. Results show Cl-MPSA-PEG-PVP additives perform well, but substitution of PVP with Janus Green B provides better terrace leveling. Additionally, NMR data show a quick and complete conversion of MPSA to bis(3-sulfopropyl) disulfide (SPS) in the acidic copper bath. Finally, FEM simulations further...

Electrodeposition of Copper for Three-Dimensional Metamaterial Fabrication

Influence of branched quaternary ammonium surfactant molecules as levelers for copper electroplating from acidic sulfate bath

Polyquaternium-2: A New Levelling Agent for Copper Electroplating from Acidic Sulphate Bath

Combing the merits of metals and semiconductors,with superior plasmon resonance effects and high charge mobility, 3D-nanocomposite structures consisting of graphene oxide (GO), noble metal nanostructures, and two-dimensional transition metal sulfides (2D-TMDS) are an important topic in surface-enhanced Raman scattering (SERS) research. This paper presents a novel GO/Ag NPs (silver nanoparticles)/WS 2 composite SERS substrate, and electric field simulation by COMSOL software. The GO/Ag/WS 2 composite substrate shows very high SERS detective sensitivity and stability to probe molecules such as rhodamine 6 g (R6G), crystal violet (CV), methylene blue (MB) and deoxyribonucleic acid (DNA). The SERS sensitivity can reach 10 −12 M, the relative standard deviation (RSD) is 8.24%, and the enhancement factor (EF) is approximately 6.60 × 10 10 for R6G, which promoted the implementation of the SERS technique in the area of quantitative profiling and testing. 

Graphene oxide/Ag nanoparticles/WS₂ nanosheet heterostructures for surface-enhanced Raman spectroscopy

The invention provides diketopyrrolopyrrole (DPP) quaternary ammonium salt compounds, which are disclosed as the structural formula in the specification, wherein N-R2 is disclosed in the specification, and R1 is Cl, Br, F, I, CF3, CN, tBu, CH3, H, 2,6-F2, NH2, NO2, OH, CHO, COOH, 3,4-Cl2, or 3-F-5-CH3; n is a whole number ranging from 1 to 18; and x is Br, F, Cl, I, HSO3, HSO4, HCO3, CF3CO3, H2PO4, OTf, OTs or BF4. The compounds have stable structure, and can not cause the phenomena of coating fogging and the like at higher temperature; the big conjugate pi bond in the compounds can be adsorbed on the copper layer surface more easily, and the N center can inhibit the deposition of copper ions more efficiently; and thus, the compounds can be used for leveling as an electroplating leveling additive.

Diketopyrrolopyrrole (DPP) quaternary ammonium salt compounds, and preparation and application thereof

The invention relates to a multi-dendritic quaternary ammonium compound, and preparation and use thereof. The multi-dendritic quaternary ammonium compound has a structure as shown in a formula I. The multi-dendritic quaternary ammonium compound provided by the invention can be applied as a leveling agent for electrocoppering with acidic copper sulfate as an electroplating liquid. In the formula I, R1 is a C1-C15 linear or branched alkyl or a C4-C12 linear or branched perfluoroalkyl group; R2 is C1-C8 linear or branched alkyl; X is Cl, Br or I; M is H, Na or K; n is an integer ranging from 2 to 8.

Multi-dendritic quaternary ammonium compound, and preparation and use thereof

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