Droplet deposition apparatus comprising an array of fluid chambers defined by a pair of opposing chamber walls, and in fluid communication with a nozzle for droplet ejection therefrom; a cover member is joined to the edges of the chamber walls and thus seals one side of the chambers. The cover member has a ratio of cover thickness to chamber wall separation less than or equal to 1:1.

Droplet deposition apparatus

Disclosed is a phase change ink comprising (a) a colorant and (b) a phase change ink carrier, said carrier comprising (i) a branched triamide and (ii) a polyethylene wax having an average peak molecular weight of from about 350 to about 730 and a polydispersity of from about 1.0001 to about 1.500. Also disclosed is a process which comprises (1) incorporating into an ink jet printing apparatus a phase change ink comprising (a) a colorant and (b) a phase change ink carrier, said carrier comprising (i) a branched triamide and (ii) a polyethylene wax having an average peak molecular weight of from about 350 to about 730 and a polydispersity of from about 1.0001 to about 1.500; (2) melting the ink; and (3) causing droplets of the melted ink to be ejected in an imagewise pattern onto a substrate.

Phase change inks

A "roofshooter" pagewidth printhead for use in a thermal ink jet printing device is fabricated by forming a plurality of subunits, each being produced by bonding a heater substrate having an architecture including an array of heater elements and an etched ink feed slot to a secondary substrate having a series of spaced feed hole openings to form a combined substrate in which said series of spaced feed hole openings communicates with said ink feed slot, and dicing said combined substrates through said ink feed slot to form a subunit. An array of butted subunits having a length equal to one pagewidth is formed by butting one of said subunits against an adjacent subunit. The array of butted subunits is bonded to a pagewidth support substrate. The secondary substrate provides an integral support structure for maintaining the alignment of the heater plate which, if diced through the feed hole without the secondary substrate, would separate into individual pieces, thereby complicating the alignment and assembly process.

Buttable subunits for pagewidth "Roofshooter" printheads

An improved ink jet printhead is disclosed which comprises an upper and a lower substrate that are mated and bonded together with a thick insulative layer sandwiched therebetween. One surface of the upper substrate has etched therein one or more grooves and a recess which, when mated with the lower substrate, will serve as capillary-filled ink channels and ink supplying manifold respectively. The grooves are open at one end and closed at other end. The open ends will serve as the nozzles. The manifold recess is adjacent the groove closed ends. Each channel has a heating element located upstream of the nozzle. The heating elements are selectively addressable by input signals representing digitized data signals to produce ink vapor bubbles. The growth and collapse of the bubbles expel ink droplets from the nozzles and propel them to a recording medium. Recesses patterned in the thick layer expose the heating elements to the ink, thus placing them in a pit, and provide a flow path for the ink from the manifold to the channels by enabling the ink to flow around the closed ends of the channels, thereby eliminating the fabrication steps required to open the groove closed ends to the manifold recess, so that the printed fabrication process is simplified.

Ink jet printhead

A large array ink jet printhead is disclosed having two basic parts, one containing an array of heating elements and addressing electrodes on the surface thereof, and the other containing the liquid ink handling system. At least the part containing the ink handling system is silicon and is assembled from generally identical sub-units aligned and bonded side-by-side on the part surface having the heating element array. Each channel plate sub-unit has an etched manifold with means for supplying ink thereto and a plurality of parallel ink channel grooves open on one end and communicating with the manifold at the other. The surfaces of the channel plate sub-units contacting each other are {111} planes formed by anisotropic etching. The channel plate sub-units appear to have a parallelogram shape when viewed from a direction parallel with and confronting the ink channel groove open ends. The heating element array containing part may also be assembled from etched silicon sub-units with their abutting surfaces being {111} planes. In another embodiment, a plurality of channel plate sub-units are anisotropically etched in a silicon wafer and a plurality of heating element sub-units are formed on another silicon wafer. The heating element wafer is also anisotropically etched with elongated slots. The wafers are aligned and bonded together, then diced into complete printhead sub-units which have abutting side surfaces that are {111} planes for accurate side-by-side assembly.

Large array thermal ink jet printhead

Several fabricating processes for ink jet printheads are disclosed, each printhead being composed of two parts aligned and bonded together. One part is a substantially flat substrate which contains on the surface thereof a lineal array of heating elements and addressing electrodes, and the second part is a substrate having at least one recess anisotropically etched therein to serve as an ink supply manifold when the two parts are bonded together. A lineal array of parallel grooves are formed in the second part, so that one end of the grooves communicate with the manifold recess an the other ends are open for use as an ink droplet expelling nozzles. Many printheads can be made simultaneously by producing a plurality of sets of heating elements array with their addressing electrodes on a silicon wafer and by placing alignment marks thereon at predetermined locations. A corresponding plurality of sets of channels and associated manifolds are produced in a second silicon wafer and, in one embodiment, alignment openings are etched thereon at predetermined locations. The two wafers are aligned via the alignment openings and alignment marks, then bonded together and diced into many separate printheads. A number of printheads can be fixedly mounted in a pagewidth configuration which confronts a moving recording medium for pagewidth printing or individual printheads may be adapted for carriage type ink jet printing.

Thermal ink jet printhead and process therefor

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Thermal ink jet printhead and process therefor