Polydimethylsiloxane (PDMS) foam materials with lightweight, excellent oil resistance and mechanical flexibility are highly needed for various practical applications in aerospace, transportation, and oil/water separation. However, traditional PDMS foam materials usually present poor chemical resistance and easily swell in various solvents, which greatly limits their potential application. Herein, novel fluorosilicone rubber foam (FSiRF) materials with different contents of trifluoropropyl lateral groups were designed and fabricated by a green (no solvents used) and rapid (<10 min foaming process) foaming/crosslinking approach at ambient temperature. Typically, vinyl-terminated poly(dimethyl-co-methyltrifluoropropyl) siloxanes with different fluorine contents of 0–50 mol% were obtained through ring-opening polymerization to effectively adjust the chemical resistance of the FSiRFs. Notably, the optimized FSiRF samples exhibit lightweight (~0.25 g/cm−3), excellent hydrophobicity/oleophilicity (WCA > 120°), reliable mechanical flexibility (complete recovery ability after stretching of 130% strain or compressing of >60%), and improved chemical resistance and structural stability in various solvents, making them promising candidates for efficient and continuous oil–water separation. This work provides an innovative concept to design and prepare advanced fluorosilicone rubber foam materials with excellent chemical resistance for potential oil–water separation application.

/pdf/green-and-rapid-preparation-of-fluorosilicone-rubber-foam-1eyd2hye.pdf

Green and Rapid Preparation of Fluorosilicone Rubber Foam Materials with Tunable Chemical Resistance for Efficient Oil–Water Separation

Recent years have witnessed the explosive development of highly sensitive smart sensors based on conductive polymer foam materials. However, the design and development of multifunctional polymeric foam composites as smart sensors applied in complex solvent and oil environments remain a critical challenge. Herein, we design and synthesize vinyl-terminated polytrifluoropropylmethylsiloxane through anionic ring-opening polymerization to fabricate fluorosilicone rubber foam (FSiRF) materials with nanoscale wrinkled surfaces and reactive Si-H groups via a green and rapid chemical foaming strategy. Based on the strong adhesion between FSiRF materials and consecutive oxidized ketjen black (OKB) nano-network, multifunctional FSiRF nanocomposites were prepared by a dip-coating strategy followed by fluoroalkylsilane modification. The optimized F-OKB@FSiRF nanocomposites exhibit outstanding mechanical flexibility in wide-temperature range (100 cycle compressions from -20 to 200 °C), structure stability (no detached particles after being immersed into various aqueous solutions for up to 15 days), surface superhydrophobicity (water contact angle of 154° and sliding angle of ∼7°), and tunable electrical conductivity (from 10 

Rational Design of Oil-Resistant and Electrically Conductive Fluorosilicone Rubber Foam Nanocomposites for Sensitive Detectability in Complex Solvent Environments

Hollow glass microsphere (HGM)/silicone rubber composite material was prepared by using silicone resin as the transition layer between silicone rubber and HGM. Silane coupling agent was hydrolyzed on the surface of HGM by in-situ polymerization to form the silicone resin layer. And then such modified HGM was added to the silicone rubber to prepare HGM/silicone rubber composite material. The curing process, mechanical property, morphology, thermal stability, and electrical property were studied. It is found that the transition layer of silicone resin can speed up the curing reaction. And the curing time becomes longer with the increase of HGM. The transition layer of silicone resin also improves the compatibility between HGM and silicone rubber. And the mechanical properties of the silicone rubber are reduced with the increase of HGM. The introduction of HGM can improve the thermostability of the silicone rubber. And HGM can obviously reduce the dielectric constant (from 3.4 to 2.6) and increase the dielectric breakdown strength (from 14.78 kV/mm to 16.71 kV/mm) of the samples.

Preparation and Properties of Hollow Glass Microsphere/Silicone Rubber Composite Material with the Transition Layer of Silicone Resin

Preparation of fluorosilicone rubber containing perfluorocyclobutyl aryl ether

Based on the excellent physical properties and flexible molecular modifiability, modified silicone resins have received favorable attention in the field of microelectronics, and recently a number of modified silicone resins have appeared while few breakthroughs have been made in low dielectric constant (low-k) materials field due to the limitations of structure or the curing process. In this work, functional silicone resin with different BCB contents was prepared with two monomers. The resins showed low dielectric constant (k = 2.77 at 10 MHz) and thermal stability (T5% = 495.0 °C) after curing. Significant performance changes were observed with the increase in BCB structural units, and the functional silicone obtained does not require melting and dissolution during processing because of good fluidity at room temperature. Moreover, the mechanical properties of silicone resins can be also controlled by adjusting the BCB content. The obtained silicone resins could be potentially used in the field of electronic packaging materials.

/pdf/high-thermal-stability-and-low-dielectric-constant-of-bcb-2q1p3x72.pdf

High Thermal Stability and Low Dielectric Constant of BCB Modified Silicone Resins

Hollow glass microsphere (HGM) /organic silicon resin composite materials with different quantity of HGM were prepared by in-situ hydrolytic polymerization. The hydrolysis reaction of silicone resin was carried out at the same time with the surface treatment of HGM by the silane coupling agent. It has been found that HGM was treated by silane coupling agent and the silicone resin was hydrolyzed on the surface of HGM. Such in-situ polymerization method solves the poor compatibility between HGM and silicone resin. And then the composite materials were cured by hydrosilylation. The composite material has low dielectric constant (2.40) and good heat resistance. Such new HGM/organic silicone resin composite material is expected to be used for integrated circuit packaging material.

Preparation of Hollow Glass Microsphere/Organic Silicone Resin Composite Material with Low Dielectric Constant by In-Situ Polymerization

Synthesis of polysiloxanes containing trifluoroethylene aryl ether groups: The effect of promoters

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Papers

Preparation and Properties of Hollow Glass Microsphere/Silicone Rubber Composite Material with the Transition Layer of Silicone Resin

Preparation of fluorosilicone rubber containing perfluorocyclobutyl aryl ether

Preparation of Hollow Glass Microsphere/Organic Silicone Resin Composite Material with Low Dielectric Constant by In-Situ Polymerization

Synthesis of polysiloxanes containing trifluoroethylene aryl ether groups: The effect of promoters