http://ieeexplore.ieee.org/iel5/5/31047/01444179.pdf

Fundamentals of acoustics

Microelectromechanical systems (MEMS) represents a technology that integrates miniaturized mechanical and electromechanical components (i.e., sensors and actuators) that are made using microfabrication techniques. MEMS devices have become an essential component in a wide range of applications, ranging from medical and military to consumer electronics. As MEMS technology is implemented in a growing range of areas, the reliability of MEMS devices is a concern. Understanding the failure mechanisms is a prerequisite for quantifying and improving the reliability of MEMS devices. This paper reviews the common failure mechanisms in MEMS, including mechanical fracture, fatigue, creep, stiction, wear, electrical short and open, contamination, their effects on devices' performance, inspection techniques, and approaches to mitigate those failures through structure optimization and material selection.

MEMS Reliability Review

Mapping apparatus includes a transmitter, which emits a beam comprising pulses of light, and a scanner, which is configured to scan the beam, within a predefined scan range, over a scene. A receiver receives the light reflected from the scene and to generate an output indicative of a time of flight of the pulses to and from points in the scene. A processor is coupled to control the scanner so as to cause the beam to scan over a selected window within the scan range and to process the output of the receiver so as to generate a 3D map of a part of the scene that is within the selected window.

Scanning depth engine

Inexpensive, easy-to-process, light-weight polymer-based materials that are biocompatible, mechanically flexible, and optically transparent have emerged as alternatives to metals and ceramics in the packaging of implantable sensors. These materials have been used to package components such as microelectrode arrays, telemetric coils and structural membranes. Polymers are also being used for the encapsulations and coatings of the implants. The devices and packages require fine-pitch, low-loss, and highly-conductive paths on mechanically and chemically reliable polymer films. In this review, several polymers used for implantation and related integration technologies are identified. We give an overview of novel applications of polymers in implantable sensor packages, and identify future directions for their application. Polymers exhibit high moisture absorption rate, high-frequency electrical loss, and low mechanical stability. These properties are aggravated when polymers are used for in vivo applications. Also, the integration of polymers with polymers/metals at high bonding temperatures and pressures may degrade their properties and interfaces. Furthermore, adhesive bonding and physical/chemical deposition methods for the integration may introduce non-hermetic, permeable, optically opaque, and poorly conductive interfaces. Thus, creating polymer-based high-density and small-dimension structures are critical for packaging. To address these issues, polymers with improved characteristics as well as integration techniques using low bonding temperature and pressure are indispensable. Liquid crystal polymer (LCP) and surface activated bonding (SAB) technologies meet these requirements. SAB technologies enable nanoscaled polymer–polymer/metal bonding to realize reliable, miniaturized, and high-performance packages for implantable sensors. This article is meant to serve as a reference for future research in the emerging field of implantable sensors by critically assessing the specific merits and drawbacks of several material-process combinations.

/pdf/polymer-integration-for-packaging-of-implantable-sensors-4n7j5lczsx.pdf

Polymer integration for packaging of implantable sensors

A method of scanning a light beam is disclosed. The method comprises scanning the light beam along a first axis and scanning the light beam along a second axis, such that a functional dependence of the scanning along the first axis is substantially a step-wave, and a functional dependence of the scanning along the second axis is other than a step-wave.

Method and device for scanning light

This guide is a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability. Material properties, failure mechanisms, processing techniques, device structures, and packaging techniques common to MEMS are addressed in detail. Design and qualification methodologies provide the reader with the means to develop suitable qualification plans for the insertion of MEMS into the space environment.

MEMS Reliability Assurance Guidelines for Space Applications

Handle everyday research tasks with reliable, citation-backed results

Your personal Research Agent to handle research tasks with citation-backed results

Popular Tasks used by Researchers

How can I help with your research?

Meet SciSpace

Get more enhanced response by uploading the PDFs you want me to reference.

No relevant PDFs in your library

SciSpace is the AI research assistant for academics. Run systematic literature reviews on 280M+ papers, and write papers with cited sources. Trusted by 1M+ students, PhDs & researchers.

SciSpace | AI for Research

Analyze PDFs

Code & Manuscripts

Funding & Grants

Literature & Patents

Medical & Clinical Data

Systematic Review

Visualize & Present

Web & Data

Build a Google Scholar-like website for your research.

Build a website

Create charts and images for your research

Create a Chart

Write a paper for submission to a journal

Draft a manuscript

Patent Search

Design eye-catching scientific posters in minutes.

Scientific Poster Generation

Systematic Literature Review

One task is running at the moment. Your messages will be shown right after.

Drag and drop or click here to browse

Loved by <highlight>1 million+</highlight> researchers

Extract a list of specific topics and their sources from unstructured text

Topics

Compare and analyze relevant papers that matches with your search

Papers

Get insights from PDFs and bookmarked papers from your library

My library

Recent searches

Try searching for:

Catch AI-generated content in scholarly and non-scholarly content

{ai} Detector

Ai Writer

Get PDF Summaries, highlighted text explanations 

Chat with PDF

Effortlessly create in-text citations and bibliographies in APA and 2,500 other formats

Citation generator

Get explanations, summaries, and answers on academic papers

Ease up your research workflow with {scispace}'s cohort of exciting AI tools

Elevate your academic writing skills and convey your ideas the way you want

Paraphraser

Explore our range of reading and writing tools

Your file is being prepared and should be ready in a few minutes. If it's a large file, it might take a bit longer. You can close this window, and we'll email you the file when it's done.

You have reached a maximum limit of <strong>{limit}</strong> columns in the table. Remove at least <strong>1</strong> column to add or create another one.

Brian Stark

Author Tools

Chat about Author

Papers

MEMS Reliability Assurance Guidelines for Space Applications