Boping Wu
Intel
27 Papers
319 Citations
Boping Wu is an academic researcher from Intel. The author has contributed to research in topics: Signal integrity & Printed circuit board. The author has an hindex of 11, co-authored 27 publications. Previous affiliations of Boping Wu include University of Washington.
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Papers
Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered Dielectrics
Boping Wu,Leung Tsang +1 more
TL;DR: In this paper, the dyadic Green's functions of layered dielectrics are expressed in vector cylindrical waves and modal representations and derived for admittances and S-parameters of single via and multiple vias structures.
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Modeling Multiple Vias With Arbitrary Shape of Antipads and Pads in High Speed Interconnect Circuits
Boping Wu,Leung Tsang +1 more
TL;DR: In this article, a semi-analytical approach based on Foldy-Lax multiple scattering equations and modal expansions is proposed to solve massively coupled multiple vias with arbitrary shape of antipads and pads in high speed interconnect circuits.
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Full-wave modeling of multiple vias using differential signaling and shared antipad in multilayered high speed vertical interconnects
Boping Wu,Leung Tsang +1 more
TL;DR: A 3D full-wave approach, based on the Foldy-Lax multiple scattering equations, is successfully extended to model massively- coupled multiple vias using difierential signaling and shared antipad in high speed vertical interconnects.
Fast Computation of Layered Medium Green's Functions of Multilayers and Lossy Media Using Fast All-Modes Method and Numerical Modified Steepest Descent Path Method
Boping Wu,Leung Tsang +1 more
TL;DR: In this article, the fast all-modes method (FAM) and the numerical modified steepest descent path method (NMSP) were used to calculate the spatial Green's function for a single-layer lossless dielectric medium over a perfect electric conductor.
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Full-Wave Solver for Microstrip Trace and Through-Hole Via in Layered Media
TL;DR: In this paper, a 3D full wave solver for a microstrip line and through-hole via in layered media is presented, where the interior layer problem, consisting of vias between two reference planes, is solved using the Foldy-Lax multiple scattering equations.
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