The present invention provides a low-profile printed circuit board including a substrate having at least one planar magnetic element supported thereon. The element includes a planar winding integral with the conductive circuit formed on either one or the other side of the board, and electrical communication is made from one side of the board to the other side via plated through holes provided in the substrate. Additional planar windings may be surface mounted to the winding carried by the substrate. A dielectric coating is also provided which completely isolates the winding of the planar magnetic element.

Low profile printed circuit board

A method of making a molded circuit board includes forming a polymer base with a channel and an intersecting through-hole. The base is conductively coated by means of vacuum deposition to establish a circuit line. After the conductive coating is removed everywhere except the channel and the through-hole, a further conductive material is provided on the coating. The base is subsequently stress relieved and planarized.

Method of making molded circuit board

A miniaturized or chip-type HF magnetic-coil arrangement, e.g. a toroidal core transformer, comprising a basic body (1) of plastic material, which is provided with openings for magnetic cores (2), the upper side (10) and the lower side (11) of said basic body (1) including electric conductors (5) and the interior thereof being provided with plated-through holes in openings (16) to which the conductors (5) are connected in such a way that individual turns around the magnetic core are formed, said turns defining windings of coils (6, 7). Moreover, methods are provided, which permit a production of these arrangements in large numbers of pieces.

Methods of producing a chip-type HF magnetic coil arrangement

A metalization process for the manufacture of hybrid integrated circuit elements including boards and semiconductors to be attached thereto involves applying to a substrate of insulating material such as aluminum oxide, successive layers of sputtered nickel-chromium and nickel, an electroless deposit of nickel-boron and, frequently, an electro-deposited layer of gold. The assembly is then normally heat-treated to stabilize the resistive layer. The addition of the nickel-boron layer provides many advantages in that reliable low-temperature solder connections may be made to it, ultrasonic wire bonds of high reliability may be accomplished with the usual aluminum wire supplied with most discrete components, the heat-treating step is considerably shortened in time with greater stability of resistance values, and the assemblies thus manufactured are capable of operating in comparatively high-temperature environments. The same metalization process applied to semiconductors renders them easily solderable and avoids using high temperature eutectic bonding with the accompanying exposure of the semiconductors to elevated temperatures, often for prolonged periods. As a result, circuit assemblies thus manufactured are readily repairable, in most instances, since no high-temperature bonds are required.

Method of manufacture of solderable thin film microcircuit with stabilized resistive films

A method of forming an electrically conductive pattern on a substrate includes the steps of forming a layer of gold (6) on an electrically insulating substrate (2) and coating the gold layer (6) with a photo-resist (8). The resist (8) is exposed to light through a photo mask and the exposed portions of the photo-resist (8) are selectively removed by etching. The now exposed parts of the gold layer (6) are coated with copper (12) and the remaining photo-resist (8) is removed. The exposed parts of the gold layer (6) and the copper (12) are subjected to molten tin (14) which simultaneously acts to dissolve the exposed parts of the gold layer (6) and to form an electrically conductive coating on the copper (12). The process enables the formation of a precise conductive pattern with enhanced reliability.

Methods of and apparatus for forming conductive patterns on a substrate

An insulating substrate is first coated with a film of tantalum Then either a layer of copper or two layers of copper separated by a diffusion barrier layer of iron, nickel or cobalt are applied by sputtering to metallize the surface With a photolithographic mask to protect the circuit and component pattern, the copper and tantalum are etched to bare the substrate Then with a screen printed mask, the copper is selectively etched over resistor and capacitor regions, and the tantalum there is partially oxidized, the copper conductors and contact areas being protected A soft solder is then applied to the copper, but does not stick to the oxide

Method of making a thin film electronic circuit unit

An insulating substrate is first coated with a film of tantalum. Then either a layer of copper or two layers of copper separated by a diffusion barrier layer of iron, nickel or cobalt are applied by sputtering to metallize the surface. With a photolithographic mask, the copper and tantalum are etched to bare the substrate. Then with a screen printed mask, the copper is selectively etched over resistor and capacitor regions, and the tantalum there is partially oxidized, the copper conductors and contact areas being protected. Solder is then applied to the copper, but does not stick to the oxide.

Thin film electronic circuit unit and method of making the same

Sicherheitseinrichtung an motorisch verschliessbaren oeffnungen von kraftfahrzeugen

Inductive element, particularly repeater, having at least one coil (2, 3 resp. 37, 38 resp. 55) arranged on an insulating support (1 resp. 30 resp. 50) in the form of printed conducting tracks (10 to 13 resp. 31 to 36 resp. 51 to 54), as well as a closed ferrite core (6 resp. 41 resp. 56). The insulating support (1 resp. 30 resp. 50) is comprised of a resilient material which, after deformation, automatically and resiliently returns to its plane. In the insulating support (1 resp. 30 resp. 50) recesses (4, 5 resp. 39, 40 resp. 58) are provided to receive the ferrite core (6 resp. 41 resp. 56) as well as insertion slots (7, 8 resp. 42, 43 resp. 57) opening in the recesses for the core (6 resp. 41 resp. 56). The bridge (15 resp. 48 resp. 60) traversing the ferrite core (6 resp. 41 resp. 56) and the segment (16 resp. 45 resp. 61) of the insulating support (1 resp. 30 resp. 50) which is delimited by two adjacent slots (7, 8, resp. 42, 43) form together a resilient tongue (17 resp. 46 resp. 59) which may be lifted from the plane of the insulating support (1 resp. 30 resp. 50) for inserting the core (6 resp. 41 resp. 56) into the recesses (4, 5 resp. 39, 40 resp. 58) and which returns to its place in the plane after having being released, due to its own resilience, the tongue bridge (15 resp. 48 resp. 60) centering and unloosably holding the ferrite core (6 resp. 41 resp. 56) in the recesses (4, 5 resp. 39, 40 resp. 58).

Inductive element, particularly repeater

Induktives element, insbesondere übertrager

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