Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure and damage in Sn-3Ag-0.5Cu joints throughout a ball grid array (BGA) package using EBSD mapping of localised subgrains, recrystallisation and heavily coarsened Ag 

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The role of microstructure in the thermal fatigue of solder joints

The electrochemical corrosion behaviour and corrosion mechanism of Sn-9Zn-xGe alloy in 3.5 wt.% NaCl solution was investigated using electrochemical techniques combined with surface characterization techniques. The results showed that the alloy corrosion was mainly affected by the rupture of passivation film and Cl- migration along grain boundaries. Trace Germanium (Ge) addition refined the microstructure and improved the corrosion potential of the alloy. Solder alloys containing 0.6 wt.% Ge formed a uniform and dense passivation film on the corrosion surfaces, which reduced the corrosion rate and increased the corrosion resistance. 

Electrochemical corrosion behaviour and corrosion mechanism of Sn-9Zn-xGe solder alloys in NaCl solution

Enhanced ductility via high-density nanoprecipitates driven by chemical supersaturation in a flash-heated precipitation-strengthened high-entropy alloy

Abstract The use of innovative Co–Mg–La ferrite nanoparticles (ferrite) facilitates the production of superior Pb-free solder alloy materials that suffer from the strength-ductility trade-off (SDT). The current study introduces an original Pb-free Sn-1Ag-0.5Cu (SAC105) electrical connection alloy. It is fortified with cutting-edge ferrite and nickel providing a novel approach for improving SDT by avoiding early necking throughout different temperatures. The heterogeneous structures in Sn-1Ag-0.5Cu (SAC105) alloy are assembled by controlling a fraction of reinforcing ferrite and Ni, processed under cold-drawn and partial recrystallization. The optimal ferrite concentration in SAC105 composites is about 0.3 wt%, which possesses a significant strain hardening potential and the highest strength-ductility synergy. The excessive degree of heterogeneity of SAC105-0.3ferrite induces numerous strengthening mechanisms and dislocation accumulation, resulting in attaining high ultimate tensile strength (UTS) of 40.7 MPa with significant ductility of ∼47.7%, with ∼34.3% and 39% increasing when compared to SAC105. Once SAC105 solder was doped with 0.3 wt% ferrite or 0.05Ni with 0.3 wt% ferrite, the activation energy transferred from pipe diffusion to lattice diffusion. The solitary Ni addition, on the other hand, results in the SDT of plain SAC105. 

Exceptional strength-ductility synergy of Ni and Co–Mg–La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite


 The mechanical characteristics of Sn-1.5Ag-0.5Cu (SAC155) alloy modified with In, Bi, and Te microalloying are investigated in relation to three strengthening mechanisms that withstand coarsening: i) micron-scale Ag3Sn, Cu6Sn5, SnTe, Ag2In and InSn4 IMC precipitated phases, ii) Bi in solid solution and iii) Bi precipitated particles formed upon eutectic solidification. Compared to SAC155 alloy with a single strengthening mechanism, the combined effect of threedeformation processes operating in SAC(155)-3Bi-2In with high In content and SAC(155)-3Bi-0.2Te (wt%) with low Te content alloys greatly improved the mechanical properties at high temperatures. It was found that, despite a discernible reduction in ductility, the high In content could refine the microstructure,enrich the elastic modulus (E), yield stress (YS), and ultimate tensile strength (UTS) of SAC(155)-3Bi-2In to almost 2.3 times that of SAC155 solder. On the other hand, a low Te content greatly increased SAC(155)-3Bi-0.2Te's mechanical strength ⁓2.3 times, while a large atomic size difference between Te and Sn atoms caused excessive misfit strain, which in turn increased Bi's solubility in β-Sn grains, and improved ductility by approximately twice that of SAC(155)-3Bi-2In solder.

Mechanical property optimization of Sn-1.5Ag-0.5Cu solder alloys with additions of Bi, In, and Te

Hypo-eutectic microstructure formation and nanomechanical response in Sn-3.0Ag-0.5Cu solder balls: Effects of undercooling

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Hypo-eutectic microstructure formation and nanomechanical response in Sn-3.0Ag-0.5Cu solder balls: Effects of undercooling