B. Imbert
University of Grenoble
8 Papers
24 Citations
B. Imbert is an academic researcher from University of Grenoble. The author has contributed to research in topics: Direct bonding & Anodic bonding. The author has an hindex of 5, co-authored 8 publications. Previous affiliations of B. Imbert include European Automobile Manufacturers Association.
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Papers
Voiding Phenomena in Copper-Copper Bonded Structures: Role of Creep
P. Gondcharton,B. Imbert,L. Benaissa,Marc Verdier +3 more
- 14 Aug 2014
TL;DR: In this article, the authors demonstrate that voiding phenomena are related to a stress-driven vacancy diffusion very comparable to standard metallurgical creep mechanisms, among all the possible options, two predominant sources have been identified.
21
Kinetics of low temperature direct copper---copper bonding
TL;DR: In this paper, the authors focus on bonding strengthening mechanisms in the low temperature range from 20 to 100 °C, in order to improve the bonding interface closure, several process parameters are studied: water amount available when surfaces are brought into contact and copper layers deposition technique have been identified to be predominant in this low- temperature range.
16
Effect of Copper–Copper Direct Bonding on Voiding in Metal Thin Films
TL;DR: In this paper, the authors compared different bonded structures specifically designed to identify the origin of void formation and its contribution to the reliability problem in 3D metal integration and found that mechanical stress caused by different dilatation of silicon substrates and metal thin films leads to metallurgical creep.
12
Copper-copper direct bonding: Impact of grain size
P. Gondcharton,B. Imbert,L. Benaissa,Marc Verdier +3 more
- 18 May 2015
TL;DR: In this article, the effect of grain size on direct bonding of polycrystalline copper thin films was studied and it was shown that a larger grain size enables limiting the copper barrier interface damage and preserves a strong mechanical link between substrates.
10
Wafer level metallic bonding: Voiding mechanisms in copper layers
B. Imbert,P. Gondcharton,L. Benaissa,Frank Fournel,Marc Verdier +4 more
- 12 Nov 2015
TL;DR: In this paper, the authors investigated the role of the mechanical stress sustained by polycrystalline copper layers during post-bonding thermal processes in the voiding phenomenon and found that it is the main contribution in the phenomenon.
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